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公开(公告)号：US08807203B2
公开(公告)日：2014-08-19
申请号：US13055111
申请日：2009-07-21
Applicant: Noel C. MacDonald , Carl D. Meinhart , Changsong Ding , Payam Bozorgi , Gaurav Soni , Brian D. Piorek
Inventor： Noel C. MacDonald , Carl D. Meinhart , Changsong Ding , Payam Bozorgi , Gaurav Soni , Brian D. Piorek
CPC classification number: F28D15/04 , F28D15/046 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
Abstract translation: 描述了钛基热接地平面。 根据本发明的热接地平面包括包括多个柱的钛基底，其中可以任选地氧化多个Ti柱以形成纳米结构的二氧化钛涂覆的柱，以及与多个钛柱连通的蒸气腔 用于将热能从热接地平面的一个区域传送到热接地平面的另一个区域。
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公开(公告)号：US20110120674A1
公开(公告)日：2011-05-26
申请号：US13055111
申请日：2009-07-21
Applicant: Noel C. MacDonald , Carl D. Meinhart , Changsong Ding , Payam Bozorgi , Gaurav Soni , Brian D. Piorek
Inventor： Noel C. MacDonald , Carl D. Meinhart , Changsong Ding , Payam Bozorgi , Gaurav Soni , Brian D. Piorek
CPC classification number: F28D15/04 , F28D15/046 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
Abstract translation: 描述了钛基热接地平面。 根据本发明的热接地平面包括包括多个柱的钛基底，其中可以任选地氧化多个Ti柱以形成纳米结构的二氧化钛涂覆的柱，以及与多个钛柱连通的蒸气腔 用于将热能从热接地平面的一个区域传送到热接地平面的另一个区域。
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