METHOD AND APPARATUS FOR LASER MACHINING
    1.
    发明申请
    METHOD AND APPARATUS FOR LASER MACHINING 审中-公开
    激光加工的方法和装置

    公开(公告)号:US20080053973A1

    公开(公告)日:2008-03-06

    申请号:US11757157

    申请日:2007-06-01

    IPC分类号: B23K26/38

    摘要: An exemplary method for laser machining is provided comprising: providing a workpiece, the workpiece including a predetermined machining region; loading the workpiece onto a laser machining station, the laser machining station being configured for providing an initial ambient temperature for the workpiece; heating the machining region of the workpiece up to a predetermined temperature between the initial ambient temperature and a melting temperature of a material of the workpiece; and machining the machining region with at least one laser beam. An exemplary apparatus for laser machining is also provided.

    摘要翻译: 提供了一种用于激光加工的示例性方法,包括:提供工件,所述工件包括预定的加工区域; 将所述工件装载到激光加工站上,所述激光加工台被配置为提供所述工件的初始环境温度; 将工件的加工区域加热到初始环境温度和工件材料的熔化温度之间的预定温度; 并用至少一个激光束加工加工区域。 还提供了用于激光加工的示例性装置。

    Heat treatment for particle reinforced alumina ceramic composite
    2.
    发明授权
    Heat treatment for particle reinforced alumina ceramic composite 失效
    颗粒增强氧化铝陶瓷复合材料的热处理

    公开(公告)号:US5425909A

    公开(公告)日:1995-06-20

    申请号:US916886

    申请日:1992-07-20

    摘要: A heat treatment method is disclosed for improving the strength and the toughness of particle reinforced alumina composite. A densified alumina composite is heated to a temperature of higher than 600.degree. C., maintained at that temperature for about 0.5-150 hours, and then the temperature is lowered to room temperature. As a result, the flexure strength and the fracture tougnness of the particle reinforced alumina composite are substantially increased after the heat treatment in comparison to those without heat treatment.

    摘要翻译: 公开了一种用于提高颗粒增强氧化铝复合材料的强度和韧性的热处理方法。 将致密化的氧化铝复合体加热至高于600℃的温度,在该温度下保持约0.5-150小时,然后将温度降至室温。 结果,与没有热处理的那些相比,热处理后的颗粒增强氧化铝复合材料的挠曲强度和断裂韧性显着增加。

    METHOD FOR PROCESSING BRITTLE SUBSTRATES WITHOUT MICRO-CRACKS
    3.
    发明申请
    METHOD FOR PROCESSING BRITTLE SUBSTRATES WITHOUT MICRO-CRACKS 审中-公开
    用于处理没有微裂纹的基片的方法

    公开(公告)号:US20080035617A1

    公开(公告)日:2008-02-14

    申请号:US11626037

    申请日:2007-01-23

    IPC分类号: B23K26/38 B23K26/40

    摘要: A method for processing a brittle substrate includes first providing a brittle substrate having a substrate surface. Then applying a first laser beam onto the brittle substrate surface to form a pre-cut groove in the brittle substrate, the first laser beam being generated by a solid-state laser device. A second laser beam is then applied onto the brittle substrate surface along the precut groove to heat the brittle substrate, the second laser beam being generated by a gas laser device. Finally, a coolant is applied onto the brittle substrate along the pre-cut groove so as to cause formation of a through crack in the brittle substrate. The first laser beam can be generated by a solid-state laser device, the first laser beam should be of narrow diameter and high energy density, so the first laser beam can form a pre-cut groove rapidly and accurately without generation of micro-cracks, in addition, the pre-cut groove should have a better uniformity and linearity.

    摘要翻译: 一种脆性基板的处理方法包括:首先提供具有基板表面的脆性基板。 然后将第一激光束施加到脆性基板表面上以在脆性基板中形成预切割凹槽,第一激光束由固态激光装置产生。 然后沿着预切槽将第二激光束施加到脆性衬底表面上以加热脆性衬底,第二激光束由气体激光器件产生。 最后,将冷却剂沿着预切割槽施加到脆性基底上,以便在脆性基底中形成通孔。 第一激光束可以由固态激光装置产生,第一激光束应具有窄直径和高能量密度,因此第一激光束可以快速而准确地形成预切割槽,而不产生微裂纹 另外,预切槽应具有更好的均匀性和线性。

    Method for making high performance self-reinforced silicon carbide using
a pressureless sintering process
    4.
    发明授权
    Method for making high performance self-reinforced silicon carbide using a pressureless sintering process 失效
    使用无压烧结工艺制造高性能自增强碳化硅的方法

    公开(公告)号:US5656218A

    公开(公告)日:1997-08-12

    申请号:US445238

    申请日:1995-05-19

    CPC分类号: F27D1/0006 C04B35/565

    摘要: A sintered silicon carbide (SiC) body prepared by a process which contains the steps of: (a) preparing a raw batch containing: (i) a raw silicon carbide mixture containing about 10 to about 90 weight percent of an .alpha.-phase SiC powder and about 90 to about 10 weight percent of a .beta.-phase SiC powder; (ii) aluminum oxide (Al.sub.2 O.sub.3) powder, about 3 to 15 weight percent of the raw silicon carbide mixture; (iii) yttrium oxide (Y.sub.2 O.sub.3) powder, about 2 to 10 weight percent of the raw silicon carbide mixture; (iv) an organic binding agent and a dispersing agent; and (v) deionized water; (b) drying the raw batch to form a green body; (c) heating the green body at temperatures between about 400.degree. and 800.degree. C. to remove the organic binding agent and the dispersing agent; and (d) subjecting the green body to a two-stage pressureless sintering process, first at a first sintering temperature between about 1,800.degree. and about 1,950.degree. C. for 0.5 to 8.0 hours, then at a second sintering temperature between about 1,900.degree. and about 2,200.degree. C. for 0.1 to 4 hours, wherein the second sintering temperature is selected such that it is higher than the first sintering temperature. The sintered silicon carbide bodies were measured to have a flexural strength of at least 500 MPa, measured using a four-point method; and a fracture toughness of at least 5.0 MPa-m.sup.0.5, measured based on a precrack thickness of 0.15 mm.

    摘要翻译: 一种通过包括以下步骤的方法制备的烧结碳化硅(SiC)体,其包括以下步骤:(a)制备原料批料,其包含:(i)含有约10-约90重量%的α相SiC粉末的原始碳化硅混合物 和约90至约10重量%的β相SiC粉末; (ii)氧化铝(Al 2 O 3)粉末,约3〜15重量%的原料碳化硅混合物; (iii)氧化钇(Y 2 O 3)粉末,约2至10重量%的原料碳化硅混合物; (iv)有机粘合剂和分散剂; 和(v)去离子水; (b)干燥原料以形成生坯; (c)在约400℃至800℃之间的温度下加热生坯以除去有机粘合剂和分散剂; 和(d)使生坯进行两阶段无压烧结工艺,首先在约1800至约1900℃的第一烧结温度下进行0.5至8.0小时,然后在约1900度和 约2200℃下进行0.1〜4小时,其中选择第二烧结温度使其高于第一烧结温度。 使用四点法测定烧结碳化硅体的弯曲强度为500MPa以上; 并且基于0.15mm的预备厚度测量的至少5.0MPa-m0.5的断裂韧性。