Lens test device and method
    1.
    发明授权
    Lens test device and method 有权
    镜头测试装置及方法

    公开(公告)号:US08817246B2

    公开(公告)日:2014-08-26

    申请号:US13567378

    申请日:2012-08-06

    IPC分类号: G01B9/00

    CPC分类号: G01M11/0292

    摘要: A lens testing method is disclosed which comprises the following three steps. First, test a lens under test to obtain a testing characteristic value of the lens under test for a first object distance. Second, provide a correction datum. Third, calculate a simulated characteristic value for a second object distance according to the testing characteristic value and the correction datum.

    摘要翻译: 公开了一种透镜测试方法,包括以下三个步骤。 首先,测试被测镜片,以获得第一物体距离的被测镜片的测试特性值。 二,提供校正基准。 第三,根据测试特性值和校正基准计算第二个物体距离的模拟特征值。

    Lens Test Device And Method
    2.
    发明申请
    Lens Test Device And Method 有权
    镜头测试装置及方法

    公开(公告)号:US20130162983A1

    公开(公告)日:2013-06-27

    申请号:US13567378

    申请日:2012-08-06

    IPC分类号: G01B9/00

    CPC分类号: G01M11/0292

    摘要: A lens testing method is disclosed which comprises the following three steps. First, test a lens under test to obtain a testing characteristic value of the lens under test for a first object distance. Second, provide a correction datum. Third, calculate a simulated characteristic value for a second object distance according to the testing characteristic value and the correction datum.

    摘要翻译: 公开了一种透镜测试方法,包括以下三个步骤。 首先,测试被测镜片,以获得第一物体距离的被测镜片的测试特性值。 二,提供校正基准。 第三,根据测试特性值和校正基准计算第二个物体距离的模拟特征值。

    Fabricating method and structure of a wafer level module
    3.
    发明授权
    Fabricating method and structure of a wafer level module 有权
    晶圆级模块的制造方法和结构

    公开(公告)号:US08193599B2

    公开(公告)日:2012-06-05

    申请号:US12646094

    申请日:2009-12-23

    IPC分类号: H01L31/0203

    摘要: A fabricating method includes adhering an exposed surface of a first solid adhesive film to a first substrate. The second surface of the first solid adhesive film is exposed and adhered to a second substrate. A third substrate is adhered to a second substrate via a patterned second solid adhesive film, and a diaphragm layer is adhered to the third substrate via a patterned third solid adhesive film. A fourth solid adhesive film with a removable release film is adhered to the first substrate covered, followed by slicing to form wafer level lens modules.

    摘要翻译: 制造方法包括将第一固体粘合剂膜的暴露表面粘附到第一基底。 第一固体粘合剂膜的第二表面暴露并粘附到第二基底。 第三基板通过图案化的第二固体粘合剂膜粘附到第二基板,并且隔膜层通过图案化的第三固体粘合膜粘附到第三基板。 将具有可移除脱模膜的第四固体粘合剂膜粘附到被覆盖的第一基板上,然后切片以形成晶片级透镜模块。

    FABRICATING METHOD AND STRUCTURE OF A WAFER LEVEL MODULE
    4.
    发明申请
    FABRICATING METHOD AND STRUCTURE OF A WAFER LEVEL MODULE 有权
    水平模块的制作方法和结构

    公开(公告)号:US20110049547A1

    公开(公告)日:2011-03-03

    申请号:US12646094

    申请日:2009-12-23

    摘要: A fabricating method and structure form a wafer level module with a solid adhesive film. A first solid adhesive film includes a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film. Openings are patterned through the first solid adhesive film. After removing parts of the first release film to expose the first surface of the first solid adhesive film, the exposed first surface of the first solid adhesive film is aligned and adhered to a first substrate.

    摘要翻译: 制造方法和结构形成具有固体粘合剂膜的晶片级模块。 第一固体粘合膜包括分别覆盖第一固体粘合膜的第一表面和第二表面的第一释放膜和第二释放膜。 开口通过第一固体粘合剂膜图案化。 在去除第一剥离膜的部分以暴露第一固体粘合剂膜的第一表面之后,将第一固体粘合剂膜的暴露的第一表面对准并粘附到第一基底。