Abstract:
A method for eliminating interference in a receiver (RX) includes: obtaining Bluetooth (BT) information and wireless local area network (Wireless LAN, WLAN) information by performing detection on at least one RX signal, wherein the RX signal is received through an antenna of the RX, and the RX signal includes components of both a BT signal and a WLAN signal that are respectively emitted from at least one transmitter (TX); and performing maximum likelihood (ML) joint detection on frequency representatives of the RX signal according to the BT information and the WLAN information and according to a predetermined library, in order to extract at least one of a reproduced version of the BT signal and a reproduced version of the WLAN signal. An associated apparatus is also provided.
Abstract:
A method for eliminating interference in a receiver (RX) includes: obtaining Bluetooth (BT) information and wireless local area network (Wireless LAN, WLAN) information by performing detection on at least one RX signal, wherein the RX signal is received through an antenna of the RX, and the RX signal includes components of both a BT signal and a WLAN signal that are respectively emitted from at least one transmitter (TX); and performing maximum likelihood (ML) joint detection on frequency representatives of the RX signal according to the BT information and the WLAN information and according to a predetermined library, in order to extract at least one of a reproduced version of the BT signal and a reproduced version of the WLAN signal. An associated apparatus is also provided.
Abstract:
The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure.