Method for eliminating interference in a receiver, and associated apparatus
    1.
    发明授权
    Method for eliminating interference in a receiver, and associated apparatus 有权
    用于消除接收机和相关设备中的干扰的方法

    公开(公告)号:US08761136B2

    公开(公告)日:2014-06-24

    申请号:US12973936

    申请日:2010-12-21

    CPC classification number: H04L25/03331

    Abstract: A method for eliminating interference in a receiver (RX) includes: obtaining Bluetooth (BT) information and wireless local area network (Wireless LAN, WLAN) information by performing detection on at least one RX signal, wherein the RX signal is received through an antenna of the RX, and the RX signal includes components of both a BT signal and a WLAN signal that are respectively emitted from at least one transmitter (TX); and performing maximum likelihood (ML) joint detection on frequency representatives of the RX signal according to the BT information and the WLAN information and according to a predetermined library, in order to extract at least one of a reproduced version of the BT signal and a reproduced version of the WLAN signal. An associated apparatus is also provided.

    Abstract translation: 一种用于消除接收机(RX)中的干扰的方法包括:通过对至少一个RX信号执行检测来获得蓝牙(BT)信息和无线局域网(Wireless LAN,WLAN)信息,其中RX信号通过天线接收 RX信号,并且RX信号包括分别从至少一个发射机(TX)发射的BT信号和WLAN信号的分量; 并且根据BT信息和WLAN信息并根据预定库对RX信号的频率代表执行最大似然(ML)联合检测,以便提取BT信号的再现版本和再现的至少一个 版本的WLAN信号。 还提供了一种相关联的装置。

    METHOD FOR ELIMINATING INTERFERENCE IN A RECEIVER, AND ASSOCIATED APPARATUS
    2.
    发明申请
    METHOD FOR ELIMINATING INTERFERENCE IN A RECEIVER, AND ASSOCIATED APPARATUS 有权
    消除接收器干扰的方法及相关设备

    公开(公告)号:US20120155444A1

    公开(公告)日:2012-06-21

    申请号:US12973936

    申请日:2010-12-21

    CPC classification number: H04L25/03331

    Abstract: A method for eliminating interference in a receiver (RX) includes: obtaining Bluetooth (BT) information and wireless local area network (Wireless LAN, WLAN) information by performing detection on at least one RX signal, wherein the RX signal is received through an antenna of the RX, and the RX signal includes components of both a BT signal and a WLAN signal that are respectively emitted from at least one transmitter (TX); and performing maximum likelihood (ML) joint detection on frequency representatives of the RX signal according to the BT information and the WLAN information and according to a predetermined library, in order to extract at least one of a reproduced version of the BT signal and a reproduced version of the WLAN signal. An associated apparatus is also provided.

    Abstract translation: 一种用于消除接收机(RX)中的干扰的方法包括:通过对至少一个RX信号执行检测来获得蓝牙(BT)信息和无线局域网(Wireless LAN,WLAN)信息,其中RX信号通过天线接收 RX信号,并且RX信号包括分别从至少一个发射机(TX)发射的BT信号和WLAN信号的分量; 并且根据BT信息和WLAN信息并根据预定库对RX信号的频率代表执行最大似然(ML)联合检测,以便提取BT信号的再现版本和再现的至少一个 版本的WLAN信号。 还提供了一种相关联的装置。

    HEAT SPREADING STRUCTURE
    3.
    发明申请
    HEAT SPREADING STRUCTURE 审中-公开
    散热结构

    公开(公告)号:US20110141698A1

    公开(公告)日:2011-06-16

    申请号:US12730082

    申请日:2010-03-23

    CPC classification number: H01L23/3737 H01L2924/0002 H01L2924/00

    Abstract: The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure.

    Abstract translation: 所公开的是设置在发热装置和散热部件之间的热界面层。 热界面层由树脂基体和高导热性粉末的混合物组成,其中树脂基体通过环氧树脂,二异氰酸酯和氨基固化剂反应获得。 调整二异氰酸酯和环氧树脂的比例可以改变热界面材料的硬度和粘度。 经过长时间的高温反复测试后,所述的热界面层仍保持粘胶,柔软和耐热。 热界面材料在电子设备和水槽之间的空隙中的填充效果大大提高。 热塑性热界面材料可以填充电子设备表面上的空隙或空腔,从而提高整个结构的散热效率。

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