-
公开(公告)号：US20090321055A1
公开(公告)日：2009-12-31
申请号：US12491752
申请日：2009-06-25
IPC分类号： F28D15/04
CPC分类号： F28D15/043 , F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A loop heat pipe for heat dissipating to a heat source including a first pipe, a first capillary structure, a second capillary structure, a second pipe, and a working fluid is provided. The first pipe has an evaporating portion adjacent to the heat source and a condensing portion. The first capillary structure is disposed on an inner surface of the first pipe and extends from the evaporating portion to the condensing portion. The second capillary structure is disposed on the inner surface and located within the evaporating portion. The second pipe is connected between the evaporating portion and the condensing portion. The working fluid disposed in the first pipe and the second pipe is capable of being transferred from the evaporating portion to the condensing portion via the second pipe, and is capable of being transferred from the condensing portion to the evaporating portion in the first.
摘要翻译： 提供了一种用于散热到包括第一管，第一毛细结构，第二毛细结构，第二管和工作流体的热源的回路热管。 第一管具有与热源相邻的蒸发部分和冷凝部分。 第一毛细结构设置在第一管的内表面上并从蒸发部延伸到冷凝部。 第二毛细结构设置在内表面上并位于蒸发部分内。 第二管连接在蒸发部和冷凝部之间。 设置在第一管和第二管中的工作流体能够经由第二管从蒸发部转移到冷凝部，并且能够从第一管中的冷凝部转移到蒸发部。
-
公开(公告)号：US07835152B2
公开(公告)日：2010-11-16
申请号：US12401098
申请日：2009-03-10
申请人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
发明人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
CPC分类号： G06F1/203
摘要： A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.
摘要翻译： 散热模块包括散热单元，具有位置限制孔的集热板，连接在散热元件和集热板之间的导热构件和固定结构。 固定结构包括两个端部，一个弓形弹性部分，以及一个连接到弓形弹性部分并延伸穿过位置限制孔的位置限制部分。 每个端部可滑动地设置在集热板上。 弓形弹性部分连接在两个端部之间并且适于紧固到集热板和基座，使得电气部件夹在集热板和基座之间。
-
公开(公告)号：US20110075369A1
公开(公告)日：2011-03-31
申请号：US12684237
申请日：2010-01-08
申请人： Kuang-Chung Sun , Ting-Chiang Huang , Chiun-Peng Chen , Chih-Kuang Chung , Sheng-Chieh Hsu , Wei-Yi Lin
发明人： Kuang-Chung Sun , Ting-Chiang Huang , Chiun-Peng Chen , Chih-Kuang Chung , Sheng-Chieh Hsu , Wei-Yi Lin
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of longitudinal side surfaces, and a pair of lateral side surfaces including a third side surface and a fourth side surface. The longitudinal side surfaces include first and second side surfaces. The lateral side surfaces include third and fourth side surfaces. The first, second, third and fourth side surfaces are connected to both the top surface and the bottom surface. The heat pipe is disposed in contact with the heat dissipation plate, and the heat pipe and the heat generation element are disposed on the bottom surface of the heat dissipation plate. The heat pipe is disposed on the heat dissipation plate and extension of the heat pipe is not beyond the first, second, third and fourth side surfaces.
摘要翻译： 提供了一种包括发热元件，散热板和热管的电子设备。 散热板包括顶表面，底表面，一对纵向侧表面和包括第三侧表面和第四侧表面的一对横向侧表面。 纵向侧表面包括第一和第二侧表面。 横向侧表面包括第三和第四侧表面。 第一，第二，第三和第四侧表面连接到顶表面和底表面。 热管设置成与散热板接触，并且热管和发热元件设置在散热板的底表面上。 热管布置在散热板上，热管的延伸部不超过第一，第二，第三和第四侧面。
-
公开(公告)号：US20100124026A1
公开(公告)日：2010-05-20
申请号：US12401098
申请日：2009-03-10
申请人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
发明人： Shaw-Fuu Wang , Ting-Chiang Huang , Sheng-Jie Syu , Chiun-Peng Chen , Chih-Kuang Chung , Li-Ting Wang
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.
摘要翻译： 散热模块包括散热单元，具有位置限制孔的集热板，连接在散热元件和集热板之间的导热构件和固定结构。 固定结构包括两个端部，一个弓形弹性部分，以及一个连接到弓形弹性部分并延伸穿过位置限制孔的位置限制部分。 每个端部可滑动地设置在集热板上。 弓形弹性部分连接在两个端部之间并且适于紧固到集热板和基座，使得电气部件夹在集热板和基座之间。
-
-
-
搜索结果
4 条记录 (耗时 0.014 秒)
