Thin film transistor array substrate and repairing method thereof
    1.
    发明授权
    Thin film transistor array substrate and repairing method thereof 有权
    薄膜晶体管阵列基板及其修复方法

    公开(公告)号:US07324183B2

    公开(公告)日:2008-01-29

    申请号:US10906891

    申请日:2005-03-11

    CPC classification number: G02F1/136213 G02F1/136259

    Abstract: A thin film transistor array substrate and repairing methods thereof are disclosed. The thin film transistor array substrate comprises openings in each pixel electrode, each capacitor electrode and each common line. The openings of the capacitor electrode and the common line are located in the opening of the pixel electrode. The opening of the capacitor electrode exposes a portion area of the capacitor electrode and the common line. The pixel electrode is coupled to the common line through a connecting conductive layer. The MII storage capacitor Cst is formed by the pixel electrode and the capacitor electrode. When the MII storage capacitor Cst fails, the MII storage capacitor Cst can be switched to the MIM storage capacitor Cst by laser repairing.

    Abstract translation: 公开了一种薄膜晶体管阵列基板及其修复方法。 薄膜晶体管阵列基板包括每个像素电极中的开口,每个电容器电极和每条公共线。 电容器电极和公共线的开口位于像素电极的开口中。 电容器电极的开口暴露电容器电极和公共线的部分区域。 像素电极通过连接导电层耦合到公共线。 MII存储电容器Cst由像素电极和电容器电极形成。 当MII存储电容器Cst失效时,MII存储电容器Cst可以通过激光修复切换到MIM存储电容器Cst。

    THIN FILM TRANSISTOR ARRAY SUBSTRATE AND REPAIRING METHOD THEREOF
    2.
    发明申请
    THIN FILM TRANSISTOR ARRAY SUBSTRATE AND REPAIRING METHOD THEREOF 有权
    薄膜晶体管阵列基板及其修复方法

    公开(公告)号:US20060012726A1

    公开(公告)日:2006-01-19

    申请号:US10906891

    申请日:2005-03-11

    CPC classification number: G02F1/136213 G02F1/136259

    Abstract: A thin film transistor array substrate and repairing methods thereof are disclosed. The thin film transistor array substrate comprises openings in each pixel electrode, each capacitor electrode and each common line. The openings of the capacitor electrode and the common line are located in the opening of the pixel electrode. The opening of the capacitor electrode exposes a portion area of the capacitor electrode and the common line. The pixel electrode is coupled to the common line through a connecting conductive layer. The MII storage capacitor Cst is formed by the pixel electrode and the capacitor electrode. When the MII storage capacitor Cst fails, the MII storage capacitor Cst can be switched to the MIM storage capacitor Cst by laser repairing.

    Abstract translation: 公开了一种薄膜晶体管阵列基板及其修复方法。 薄膜晶体管阵列基板包括每个像素电极中的开口,每个电容器电极和每条公共线。 电容器电极和公共线的开口位于像素电极的开口中。 电容器电极的开口暴露电容器电极和公共线的部分区域。 像素电极通过连接导电层耦合到公共线。 MII存储电容器Cst由像素电极和电容器电极形成。 当MII存储电容器Cst失效时,MII存储电容器Cst可以通过激光修复切换到MIM存储电容器Cst。

    Method for manufacturing a thin gate dielectric layer for integrated circuit fabrication
    5.
    发明授权
    Method for manufacturing a thin gate dielectric layer for integrated circuit fabrication 失效
    制造用于集成电路制造的薄栅介质层的方法

    公开(公告)号:US06737362B1

    公开(公告)日:2004-05-18

    申请号:US10377568

    申请日:2003-02-28

    Abstract: The present disclosure provides a method for forming a gate stack structure for semiconductor devices. The disclosed method comprises steps such as forming a dielectric layer on a substrate; applying a plasma nitridation process on the formed dielectric layer; applying a first anneal process on the deposited dielectric layer; etching the dielectric layer to a predetermined thickness using a diluted etchant; applying a second anneal process using an oxygen environment on the etched dielectric layer after the etching; and forming a gate electrode layer on top of the dielectric layer. The etching makes the top portion of the etched dielectric layer have a significantly higher concentration of nitrogen than the lower portion of the etched dielectric layer so as the leakage current is significantly reduced.

    Abstract translation: 本公开提供了一种用于形成半导体器件的栅极堆叠结构的方法。 所公开的方法包括在衬底上形成介电层的步骤; 在形成的介电层上施加等离子体氮化处理; 在沉积的介电层上施加第一退火工艺; 使用稀释的蚀刻剂将介电层蚀刻到预定厚度; 在蚀刻后在蚀刻的电介质层上使用氧气环境进行第二退火处理; 以及在所述电介质层的顶部上形成栅电极层。 蚀刻使得蚀刻的电介质层的顶部具有比蚀刻的电介质层的下部显着更高的氮浓度,因此泄漏电流显着降低。

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