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公开(公告)号：US07341949B2
公开(公告)日：2008-03-11
申请号：US10861556
申请日：2004-06-04
IPC分类号： H01L21/302
CPC分类号： H01L24/11 , H01L24/02 , H01L2224/03912 , H01L2224/0401 , H01L2224/11462 , H01L2224/1147 , H01L2224/11472 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2224/11902 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/351 , H01L2924/00
摘要： A process for forming a lead-free bump on an electronic component includes preparing the electronic component with at least one bond pad and a passivation layer formed thereon; forming an under bump metallurgy (UBM) structure on the passivation layer and the bond pad; applying a photoresist over the passivation layer, the photoresist having at least one opening corresponding to the bond pad; depositing a thick copper layer (about 1 to 10 μm thick) in the opening by electroplating; applying a copper-free or low-copper-content solder material on the copper layer; and performing a reflowing procedure under a suitable reflow temperature profile to allow copper ions to diffuse from the copper layer to the solder material so as to form the lead-free bump. This increases the copper content in the solder material but not raising the reflow temperature profile, thereby preventing deterioration of the photoresist due to over heat.
摘要翻译： 用于在电子部件上形成无铅凸块的工艺包括：制备具有至少一个焊盘和形成在其上的钝化层的电子部件; 在钝化层和接合焊盘上形成凸块下金属（UBM）结构; 在所述钝化层上施加光致抗蚀剂，所述光致抗蚀剂具有对应于所述接合焊盘的至少一个开口; 通过电镀在开口中沉积厚铜层（约1〜10μm厚）; 在铜层上施加无铜或低铜含量的焊料; 并在合适的回流温度曲线下进行回流过程，以使铜离子从铜层扩散到焊料材料，从而形成无铅凸点。 这增加了焊料材料中的铜含量，但不会提高回流温度曲线，从而防止由于过热引起的光致抗蚀剂的劣化。
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公开(公告)号：US20050042872A1
公开(公告)日：2005-02-24
申请号：US10861556
申请日：2004-06-04
IPC分类号： H01L21/302 , H01L21/461 , H01L21/60 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/11 , H01L24/02 , H01L2224/03912 , H01L2224/0401 , H01L2224/11462 , H01L2224/1147 , H01L2224/11472 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2224/11902 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/351 , H01L2924/00
摘要： A process for forming a lead-free bump on an electronic component includes preparing the electronic component with at least one bond pad and a passivation layer formed thereon; forming an under bump metallurgy (UBM) structure on the passivation layer and the bond pad; applying a photoresist over the passivation layer, the photoresist having at least one opening corresponding to the bond pad; depositing a thick copper layer (about 1 to 10 μm thick) in the opening by electroplating; applying a copper-free or low-copper-content solder material on the copper layer; and performing a reflowing procedure under a suitable reflow temperature profile to allow copper ions to diffuse from the copper layer to the solder material so as to form the lead-free bump. This increases the copper content in the solder material but not raising the reflow temperature profile, thereby preventing deterioration of the photoresist due to over heat.
摘要翻译： 用于在电子部件上形成无铅凸块的工艺包括：制备具有至少一个焊盘和形成在其上的钝化层的电子部件; 在钝化层和接合焊盘上形成凸块下金属（UBM）结构; 在所述钝化层上施加光致抗蚀剂，所述光致抗蚀剂具有对应于所述接合焊盘的至少一个开口; 通过电镀在开口中沉积厚铜层（约1〜10μm厚）; 在铜层上施加无铜或低铜含量的焊料; 并在合适的回流温度曲线下进行回流过程，以使铜离子从铜层扩散到焊料材料，从而形成无铅凸点。 这增加了焊料材料中的铜含量，但不会提高回流温度曲线，从而防止由于过热引起的光致抗蚀剂的劣化。
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