公开(公告)号：US5821611A

公开(公告)日：1998-10-13

申请号：US554597

申请日：1995-11-06

申请人： Hitoshi Kubota ,  Masao Yamamoto ,  Komei Sudo ,  Daisuke Kitawaki ,  Takayuki Hamasaki ,  Masayoshi Akiyama ,  Hironobu Kawauchi ,  Masaru Nagano ,  Hiroshi Imai ,  Mitsunori Baba ,  Masaru Shoji ,  Hiroshi Tomochika

发明人： Hitoshi Kubota ,  Masao Yamamoto ,  Komei Sudo ,  Daisuke Kitawaki ,  Takayuki Hamasaki ,  Masayoshi Akiyama ,  Hironobu Kawauchi ,  Masaru Nagano ,  Hiroshi Imai ,  Mitsunori Baba ,  Masaru Shoji ,  Hiroshi Tomochika

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/49537 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/3025

摘要： A semiconductor device which comprises a first lead having a tip formed with an island, a semiconductor chip unit mounted on the island of the first lead by means of a solder layer and having a plurality of electrode bumps projecting away from the island, and a plurality of additional leads each of which has a tip electrically connected to the electrode bumps via respective solder deposits. The additional leads include at least second and third leads. The tips of the second and third leads are at least partially wider than the semiconductor chip.

摘要翻译： 一种半导体器件，包括具有形成有岛的尖端的第一引线，半导体芯片单元，其通过焊料层安装在第一引线的岛上并且具有多个远离岛突出的电极凸块，以及多个 的附加引线，每个引线具有通过相应的焊料沉积物电连接到电极凸块的尖端。 另外的引线至少包括第二和第三引线。 第二和第三引线的尖端至少部分地比半导体芯片宽。