公开(公告)号：US06930889B2

公开(公告)日：2005-08-16

申请号：US09811063

申请日：2001-03-16

申请人： Joe A. Harrison ,  Edward R. Stanford ,  Daniel S. Kingsley ,  Kelli A. Wise

发明人： Joe A. Harrison ,  Edward R. Stanford ,  Daniel S. Kingsley ,  Kelli A. Wise

IPC分类号： H01R12/70 ,  H01R12/72 ,  H05K1/11 ,  H01R9/00

CPC分类号： H01R12/721 ,  H01R12/7005 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/10189

摘要： A circuit board includes a substrate and electrical contacts to mate with a slot connector. The contacts include a first set of contacts that are associated with the communication of power and second set of contacts that are associated with the communication of signals and are not used to communicate power. Adjacent contacts of the first set have a first spacing, and adjacent contacts of the second set have a second spacing different from the first spacing. The circuit board has a retention profile to engage a retention mechanism of the slot connector. A housing of the slot connector may be made from a material that has a thermal conductivity of at least 0.27 W/m·K, and the slot connector housing may include fins that are formed on the slot connector to conduct heat away from circuitry of the circuit board.

摘要翻译： 电路板包括基板和与插槽连接器配合的电触头。 触点包括与电力通信相关联的第一组触点和与信号通信相关联并且不用于传达电力的第二组触点。 第一组的相邻触点具有第一间隔，并且第二组的相邻触点具有与第一间隔不同的第二间隔。 电路板具有保持轮廓以接合槽连接器的保持机构。 槽连接器的壳体可以由具有至少0.27W / mK的热导率的材料制成，并且槽连接器壳体可以包括形成在槽连接器上以将热量从电路板的电路传导出来的散热片 。