公开(公告)号：US6045682A

公开(公告)日：2000-04-04

申请号：US046869

申请日：1998-03-24

申请人： Danielle Rodriguez

发明人： Danielle Rodriguez

IPC分类号： C25D3/56

CPC分类号： C25D3/562

摘要： A tungsten alloy electroplating bath. Highly ductile tungsten alloy deposits are facilitated using a sulfur co-depositing ductility additive such as: ##STR1## wherein R.sub.1 is selected from the group consisting of H.sub.1, alkyl, alkenyl, hydroxy, halogen, carboxy and carbonyl;"AR" designates a benzene or naphthalene moiety;R.sub.2 is selected from the group consisting of H, or an alkyl sulfonic acid, a Group I or Group II salt of an alkyl sulfonic acid, a benzene, a sulfonate, a naphthalene sulfonate, a benzene sulfonamide, a naphthalene sulfonamide, an ethylene alkoxy, a propylene alkoxy; and R.sub.2 may be attached to "AR" to form a cyclic moiety; andR.sub.3 is selected from the group consisting of a benzene, a naphthalene, an unsaturated aliphatic group; and a benzenesulfonate group.The additive provides ductility improvements in tungsten alloy electroplates deposited from the solution.

摘要翻译： 钨合金电镀浴。 使用硫共沉积延展性添加剂促进高延性钨合金沉积物，例如：其中R1选自H1，烷基，烯基，羟基，卤素，羧基和羰基; “AR”表示苯或萘部分; R2选自H或烷基磺酸，烷基磺酸，苯，磺酸盐，萘磺酸盐，苯磺酰胺，萘磺酰胺，亚乙基烷氧基的烷基磺酸， ，丙烯基烷氧基; 并且R 2可以连接到“AR”以形成环状部分; 并且R 3选自苯，萘，不饱和脂族基; 和苯磺酸酯基。 该添加剂提供从溶液中沉积的钨合金电镀层的延展性改进。