公开(公告)号：US06610191B2

公开(公告)日：2003-08-26

申请号：US09992117

申请日：2001-11-13

申请人： Uziel Landau ,  John J. D'Urso ,  David B. Rear

发明人： Uziel Landau ,  John J. D'Urso ,  David B. Rear

IPC分类号： C25D502

CPC分类号： C25D7/123 ,  C25D3/38

摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

公开(公告)号：US06350366B1

公开(公告)日：2002-02-26

申请号：US09484616

申请日：2000-01-18

申请人： Uziel Landau ,  John J. D'Urso ,  David B. Rear

发明人： Uziel Landau ,  John J. D'Urso ,  David B. Rear

IPC分类号： C25D712

CPC分类号： C25D7/123 ,  C25D3/38

摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, ie., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.

摘要翻译： 本发明提供了电镀溶液，特别是金属电镀溶液，其设计用于在衬底上提供均匀的涂层，并提供基本上无缺陷的填充小特征，例如微米级特征，并且在没有或低支持电解质的衬底上形成较小的特征。 ，其不包括酸，低酸，无碱或不导电盐，和/或高金属离子，例如铜，浓度。 此外，电镀液可以含有少量添加剂，其通过用作增白剂，整理剂，表面活性剂，晶粒细化剂，减压剂等来增强镀膜质量和性能。

公开(公告)号：US6113771A

公开(公告)日：2000-09-05

申请号：US114865

申请日：1998-07-13

申请人： Uziel Landau ,  John J. D'Urso ,  David B. Rear

发明人： Uziel Landau ,  John J. D'Urso ,  David B. Rear

IPC分类号： C25D3/38 ,  C25D5/00 ,  C25D5/54 ,  C25D7/12 ,  C25D5/02

CPC分类号： C25D7/123 ,  C25D3/38

摘要： The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.