Abstract:
A voltage-controlled oscillator (VCO) of ring-connected stages, where each stage in the VCO has a first set of differential inverters biased by variable bias voltages, and a second set of differential inverters biased by fixed bias voltages. The differential inverters in each stage are connected in parallel with each other. Each set of differential inverters in a stage may contain only one differential inverter. The variable bias voltages are provided by charge pumps and associated circuits as used in well-known self-biasing schemes for phase locked loops. The fixed bias voltages are provided by a biasing circuit, matched to the circuits associated with the charge pumps, but where a fixed control voltage is applied to provide the fixed bias voltages.
Abstract:
An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.
Abstract:
A voltage-controlled oscillator (VCO) of ring-connected stages, where each stage in the VCO has a first set of differential inverters biased by variable bias voltages, and a second set of differential inverters biased by fixed bias voltages. The differential inverters in each stage are connected in parallel with each other. Each set of differential inverters in a stage may contain only one differential inverter. The variable bias voltages are provided by charge pumps and associated circuits as used in well-known self-biasing schemes for phase locked loops. The fixed bias voltages are provided by a biasing circuit, matched to the circuits associated with the charge pumps, but where a fixed control voltage is applied to provide the fixed bias voltages.
Abstract:
In one embodiment, an apparatus is constituted with a temperature sensing circuit adapted to be coupled to a current sources circuit, and configured to measure a circuit temperature and to generate a temperature-indicating signal in response to the circuit temperature and an adjustable current output by the current sources circuit; a reference voltage circuit to be coupled the current sources circuit and configured to provide a reference signal in response to a reference current output by the current sources circuit; and a trip generator circuit coupled to the temperature sensing circuit and the reference voltage circuit and configured to generate a trip point signal if a difference between the reference and the temperature-indicating signals indicates that a threshold circuit temperature has been reached or exceeded.
Abstract:
An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.