PLASMA PURGING AN IDLE CHAMBER TO REDUCE PARTICLES
    1.
    发明申请
    PLASMA PURGING AN IDLE CHAMBER TO REDUCE PARTICLES 审中-公开
    等离子体清洗空腔以减少颗粒

    公开(公告)号:US20130061871A1

    公开(公告)日:2013-03-14

    申请号:US13560837

    申请日:2012-07-27

    CPC classification number: B08B7/00 C23C16/4401 C23C16/4408 H01J37/32862

    Abstract: During each idle period in which a plasma processing tool is not used in succession, upon lapse of a selected period of inactivity by the plasma production tool of between 10 and 60 minutes, a plasma is generated within the plasma processing tool to heat the vacuum enclosure to an operating temperature reached during production use of the plasma processing tool. A gas-only purge is then performed, and the vacuum enclosure is pumped down to a base vacuum to remove small particles of less than 0.12 microns that may otherwise generate on the interior walls of the vacuum enclosure. Extended operation of the plasma processing tool without failure of particle qualification or reduced availability is achieved.

    Abstract translation: 在等离子体处理工具不连续使用的每个空闲时段期间,等离子体生产工具在10至60分钟之间经过选定的不活动周期后,在等离子体处理工具内产生等离子体,以加热真空外壳 达到等离子体处理工具的生产使用期间达到的工作温度。 然后执行只有气体的吹扫,并且将真空外壳泵送到基底真空以除去小于0.12微米的小颗粒,否则可能在真空外壳的内壁上产生。 实现等离子体处理工具的延长操作,而不会造成粒子鉴定或可用性降低。

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