公开(公告)号：US4242038A

公开(公告)日：1980-12-30

申请号：US53166

申请日：1979-06-29

申请人： Hugo A. E. Santini ,  David P. Wick

发明人： Hugo A. E. Santini ,  David P. Wick

IPC分类号： B65G51/03 ,  B65G49/07 ,  G03F9/00 ,  H01L21/677 ,  H01L21/68 ,  B65G51/02 ,  B65G47/24

CPC分类号： H01L21/67787

摘要： An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sensor projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sensor projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sensor associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sensor are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sensor (and not by contact with the respective registration surfaces), contamination of the wafer by physical contact is minimized.

摘要翻译： 描述了用于定向基本上平坦的晶片的装置和方法。 晶片优选地具有不等长度的两个平坦配准边缘。 当晶片的任何边缘部分与从一个配准表面向前突出的传感器接触时，激活空气射流以使晶片快速旋转，直到其两个配准边缘的较长时间接触从另一个配准表面向前突出的传感器。 然后激活空气喷嘴以相反的方式缓慢地旋转晶片，直到所述较长的配准边缘接触与所述另一个配准表面相关联的另一个传感器，以在所有三个传感器同时接触和激活时实现晶片的精确配准而没有过冲。 通过喷射器的晶片移动终止，并且在其上执行工作操作时连续施加真空以将晶片保持在适当位置。 由于晶片仅通过与各种传感器接触（而不是与相应的配准表面接触）来注册，所以通过物理接触对晶片的污染被最小化。