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公开(公告)号:US08838042B2
公开(公告)日:2014-09-16
申请号:US13107729
申请日:2011-05-13
Applicant: Yuan Lu , Renaldi Winoto , Jinho Park , Li Lin , Xinhua Chen , Ming He , David Signoff , Wayne Loeb
Inventor: Yuan Lu , Renaldi Winoto , Jinho Park , Li Lin , Xinhua Chen , Ming He , David Signoff , Wayne Loeb
Abstract: Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.
Abstract translation: 公开了一种发射/接收电路装置,其中在集成电路芯片上制造包括发射/接收开关的收发器电路。 匹配网络相对于集成电路芯片完全设置在片外。 在实施例中,匹配网络的至少一部分形成在片外,匹配网络的一部分形成在芯片上。
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公开(公告)号:US20110285475A1
公开(公告)日:2011-11-24
申请号:US13107729
申请日:2011-05-13
Applicant: Yuan Lu , Renaldi Winoto , Jinho Park , Li Lin , Xinhua Chen , Ming He , David Signoff , Wayne Loeb
Inventor: Yuan Lu , Renaldi Winoto , Jinho Park , Li Lin , Xinhua Chen , Ming He , David Signoff , Wayne Loeb
IPC: H01P1/15
Abstract: Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.
Abstract translation: 公开了一种发射/接收电路装置,其中在集成电路芯片上制造包括发射/接收开关的收发器电路。 匹配网络相对于集成电路芯片完全设置在片外。 在实施例中,匹配网络的至少一部分形成在片外,匹配网络的一部分形成在芯片上。
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