公开(公告)号：US20050013455A1

公开(公告)日：2005-01-20

申请号：US10781555

申请日：2004-02-18

Applicant: Wayne Loeb ,  John Neumann ,  Kaigham Gabriel

Inventor： Wayne Loeb ,  John Neumann ,  Kaigham Gabriel

IPC: B81B3/00 ,  B81B7/02 ,  H04R1/00 ,  H04R3/00 ,  H04R17/00 ,  H04R19/00 ,  H04R23/00 ,  H04R25/00 ,  H02N1/00

CPC classification number: H04R19/005 ,  H04R17/00

Abstract: An acoustic transducer comprising a substrate; and a diaphragm formed by depositing a micromachined membrane onto the substrate. The diaphragm is formed as a single silicon chip using a CMOS MEMS (microelectromechanical systems) semiconductor fabrication process. The curling of the diaphragm during fabrication is reduced by depositing the micromachined membrane for the diaphragm in a serpentine-spring configuration with alternating longer and shorter arms. As a microspeaker, the acoustic transducer of the present invention converts a digital audio input signal directly into a sound wave, resulting in a very high quality sound reproduction at a lower cost of production in comparison to conventional acoustic transducers. The micromachined diaphragm may also be used in microphone applications.

公开(公告)号：US08405220B1

公开(公告)日：2013-03-26

申请号：US11867615

申请日：2007-10-04

Applicant: Wayne Loeb ,  Tyson Leistiko ,  Huahung Kao

Inventor： Wayne Loeb ,  Tyson Leistiko ,  Huahung Kao

IPC: H01L23/48

CPC classification number: H01L23/4952 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0361 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05551 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05562 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06135 ,  H01L2224/13007 ,  H01L2224/13028 ,  H01L2224/13111 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014

Abstract: Structures, architectures, systems, an integrated circuit, methods and software for configuring an integrated circuit for multiple packaging types and/or selecting one of a plurality of packaging types for an integrated circuit. The structure generally comprises a bump pad having a plurality of electrically disconnected bump pad sections, a plurality of bond pads each configured for electrical connection to one of the bump pad sections, and a plurality of conductive traces, each adapted to electrically connect one of the bond pads to the one bump pad section. The software is generally configured to place and route components of such a structure. The method of configuring generally includes the steps of forming the bump pad, the bond pads, and the conductive traces from an uppermost metal layer, and forming an insulation layer thereover. The method of selecting generally comprises forming the uppermost metal layer, and forming either a wire bond to at least one of the bond pads, or a ball bond or solder ball to electrically connect the bump pad section. Embodiments of the present invention may advantageously provide reduced manufacturing costs and reduced inventory management issues by enabling one device to be manufactured at a wafer fab for a plurality of different packaging options, thereby enabling packaging decisions to be made at a later time in the manufacturing process.

Abstract translation: 结构，架构，系统，集成电路，用于配置用于多种封装类型的集成电路和/或选择用于集成电路的多种封装类型之一的集成电路，方法和软件。 该结构通常包括具有多个电气断开的凸块焊盘部分的凸块焊盘，多个焊接接头，每个接合焊盘都被配置为电连接到一个凸块焊盘部分，以及多个导电迹线，每个导电迹线适于电连接 接合焊盘到一个凸块焊盘部分。 该软件通常被配置为放置和路由这种结构的组件。 配置的方法通常包括从最上层的金属层形成凸块焊盘，接合焊盘和导电迹线以及在其上形成绝缘层的步骤。 选择的方法通常包括形成最上面的金属层，并且形成与至少一个接合焊盘或焊球或焊球的引线接合以电连接凸块焊盘部分。 本发明的实施例可有利地提供降低的制造成本和减少的库存管理问题，使得能够在用于多个不同包装选项的晶圆厂中制造一个装置，从而使得能够在制造过程的稍后时间进行封装决定 。

公开(公告)号：US08044716B1

公开(公告)日：2011-10-25

申请号：US12984477

申请日：2011-01-04

Applicant: Wayne Loeb ,  King Chun Tsai

Inventor： Wayne Loeb ,  King Chun Tsai

IPC: H03F1/14

CPC classification number: H03G1/0088 ,  H03F1/0261 ,  H03F1/0277 ,  H03F3/211 ,  H03F3/245 ,  H03F3/45085 ,  H03F3/602 ,  H03F2200/09 ,  H03F2200/18 ,  H03F2200/423 ,  H03F2200/451 ,  H03F2200/541 ,  H03F2203/21139 ,  H03F2203/21178 ,  H03F2203/45731 ,  H04B1/0483

Abstract: An adjustable, segmented amplifier including (i) a first fixed stage configured to amplify an analog signal in accordance with a fixed amplification, and provide the analog signal amplified in accordance with the fixed amplification to a first common node. The adjustable, segmented amplifier further includes an adjustable stage comprising a plurality of independently selectable parallel amplifier segments, wherein the adjustable stage is configured to (i) amplify the analog signal provided to the first common node in accordance with an adjustable amplification that is adjustable depending upon a number of the independently selectable parallel amplifier segments having been selected to amplify the analog signal provided to the first common node, and (ii) provide the analog signal amplified in accordance with the fixed amplification and amplified in accordance with the adjustable amplification to the second common node.

Abstract translation: 一种可调节分段放大器，包括：（i）第一固定级，被配置为根据固定放大放大模拟信号，并将根据固定放大放大的模拟信号提供给第一公共节点。 可调分段放大器还包括可调节级，其包括多个可独立选择的并联放大器段，其中可调节级被配置为（i）根据可调整的放大倍数来放大提供给第一公共节点的模拟信号 在多个独立可选择的并联放大器段被选择以放大提供给第一公共节点的模拟信号之后，以及（ii）提供根据固定放大器放大的模拟信号，并根据可调放大倍数放大到 第二个公共节点。

公开(公告)号：US07444124B1

公开(公告)日：2008-10-28

申请号：US10776476

申请日：2004-02-10

Applicant: Wayne Loeb ,  King Chun Tsai

Inventor： Wayne Loeb ,  King Chun Tsai

IPC: H03G3/10 ,  H04B1/04

CPC classification number: H03G1/0088 ,  H03F1/0261 ,  H03F1/0277 ,  H03F3/211 ,  H03F3/245 ,  H03F3/45085 ,  H03F3/602 ,  H03F2200/09 ,  H03F2200/18 ,  H03F2200/423 ,  H03F2200/451 ,  H03F2200/541 ,  H03F2203/21139 ,  H03F2203/21178 ,  H03F2203/45731 ,  H04B1/0483

Abstract: An architecture, circuits, systems and a method for amplifying an analog signal. The architecture and/or circuit generally includes a first fixed stage (e.g., a predriver) and an adjustable stage. The first fixed stage may be configured to amplify an analog signal and provide a first amplified analog output at a first common node. The adjustable stage may comprise a plurality of independently selectable parallel amplifier segments. Each of the parallel segments may have an input at the first common node and an output at a second common node, a transistor having a control terminal, and a first inductor in electrical communication with the control terminal of the transistor. The adjustable stage may be configured to apply a bias to the control terminal of the transistor in a selected segment and to provide an output signal in one of a plurality of a power ranges corresponding to a number of selected parallel amplifier segments. The output signal generally has a minimum power efficiency when two or more of the parallel segments are selected. The present invention advantageously provides a relatively compact power amplifier with an extended output power range at which the amplifier is highly efficient. In preferred embodiments, the input and output matching characteristics are generally independent of the number of selected output amplifier segments.

Abstract translation: 一种用于放大模拟信号的架构，电路，系统和方法。 架构和/或电路通常包括第一固定级（例如，预驱动器）和可调节级。 第一固定级可以被配置为放大模拟信号并且在第一公共节点处提供第一放大的模拟输出。 可调节级可以包括多个可独立选择的并联放大器段。 每个并行段可以具有在第一公共节点处的输入和在第二公共节点处的输出，具有控制端子的晶体管，以及与晶体管的控制端子电连通的第一电感器。 可调节级可以被配置为将偏置施加到所选择的段中的晶体管的控制端，并且提供与多个选择的并联放大器段对应的多个功率范围中的一个功率范围中的输出信号。 当选择两个或多个并联段时，输出信号通常具有最小功率效率。 本发明有利地提供了具有扩展输出功率范围的相对紧凑的功率放大器，在该功率范围内放大器是高效率的。 在优选实施例中，输入和输出匹配特性通常与选择的输出放大器段的数量无关。

公开(公告)号：US08838042B2

公开(公告)日：2014-09-16

申请号：US13107729

申请日：2011-05-13

Applicant: Yuan Lu ,  Renaldi Winoto ,  Jinho Park ,  Li Lin ,  Xinhua Chen ,  Ming He ,  David Signoff ,  Wayne Loeb

Inventor： Yuan Lu ,  Renaldi Winoto ,  Jinho Park ,  Li Lin ,  Xinhua Chen ,  Ming He ,  David Signoff ,  Wayne Loeb

IPC: H04B1/38 ,  H04B1/48

CPC classification number: H04B1/48 ,  H04B1/18

Abstract: Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.

Abstract translation: 公开了一种发射/接收电路装置，其中在集成电路芯片上制造包括发射/接收开关的收发器电路。 匹配网络相对于集成电路芯片完全设置在片外。 在实施例中，匹配网络的至少一部分形成在片外，匹配网络的一部分形成在芯片上。

公开(公告)号：US20110285475A1

公开(公告)日：2011-11-24

申请号：US13107729

申请日：2011-05-13

Applicant: Yuan Lu ,  Renaldi Winoto ,  Jinho Park ,  Li Lin ,  Xinhua Chen ,  Ming He ,  David Signoff ,  Wayne Loeb

Inventor： Yuan Lu ,  Renaldi Winoto ,  Jinho Park ,  Li Lin ,  Xinhua Chen ,  Ming He ,  David Signoff ,  Wayne Loeb

IPC: H01P1/15

CPC classification number: H04B1/48 ,  H04B1/18

Abstract: Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.

Abstract translation: 公开了一种发射/接收电路装置，其中在集成电路芯片上制造包括发射/接收开关的收发器电路。 匹配网络相对于集成电路芯片完全设置在片外。 在实施例中，匹配网络的至少一部分形成在片外，匹配网络的一部分形成在芯片上。

公开(公告)号：US07268990B1

公开(公告)日：2007-09-11

申请号：US10767045

申请日：2004-01-28

Applicant: Wayne Loeb ,  Alireza Shrivani-Mahdavi

Inventor： Wayne Loeb ,  Alireza Shrivani-Mahdavi

IPC: H02H9/00

CPC classification number: H03F1/52 ,  H02H9/025 ,  H03F3/191 ,  H03F2200/231 ,  H03F2200/27 ,  H03F2200/435

Abstract: A power amplifier protection circuit that includes protection circuitry to variably shunt an input radio frequency (RF) signal to AC ground, turn off bias to an output transistor of a power amplifier, and turn off the output transistor. The power amplifier protection circuit features an asymmetrical control that can quickly shut off a power amplifier, and turn on the power amplifier at a steady, controlled rate when an output transistor exceeds a predetermined threshold voltage.

Abstract translation: 一种功率放大器保护电路，其包括用于将输入射频（RF）信号可变地分流到AC地的保护电路，将偏置关断到功率放大器的输出晶体管，并关闭输出晶体管。 功率放大器保护电路具有不对称控制，可以快速切断功率放大器，并在输出晶体管超过预定阈值电压时以稳定的受控速率接通功率放大器。

公开(公告)号：US06985033B1

公开(公告)日：2006-01-10

申请号：US10753007

申请日：2004-01-06

Applicant: Kedar Shirali ,  King Chun Tsai ,  Wayne Loeb

Inventor： Kedar Shirali ,  King Chun Tsai ,  Wayne Loeb

IPC: H03F1/26

CPC classification number: H03F1/3247 ,  H03F2201/3233

Abstract: An amplifier with adjustable (pre)distortion, a predistortion adjustment circuit, systems and networks including such amplifiers and circuits, and methods for adjusting (pre)distortion in an analog amplifier. The amplifier architecture generally includes (a) a predistortion circuit configured to (i) select a value for a predistortion function from a plurality of different predistortion values, and (ii) apply the selected predistortion value to an input signal to generate a predistorted input signal; (b) an amplifier configured to amplify the predistorted input signal and provide an output signal therefrom; and (c) an adjustment circuit configured to adjust selection of the predistortion function value in response to a predetermined parameter value of the amplifier. By adjusting the predistortion function, the amplifier provides an output signal in a linear power range over a range of amplifier parameter values and avoids overcompensation that can occur when the predistortion signal is not adjustable. Furthermore, the adjustments are made in response to changes in amplifier input and/or control parameters, enabling the amplifier to stay in the linear range, rather than respond to changes that first cause the amplifier to fall out of linearity. The systems generally include the architecture, circuit or an integrated circuit that embodies one or more of the inventive concepts disclosed herein. The methods generally include the steps of (1) predistorting an input signal in accordance with a digital predistortion function to provide a predistorted signal, (2) adjusting the digital predistortion function in response to a predetermined parameter value of an amplifier, and (3) amplifying the predistorted signal with the amplifier to produce the amplified signal.

Abstract translation: 具有可调（预）失真的放大器，预失真调节电路，包括这种放大器和电路的系统和网络，以及用于在模拟放大器中调整（预）失真的方法。 放大器架构通常包括（a）预失真电路，其被配置为（i）从多个不同预失真值中选择预失真函数的值，以及（ii）将所选择的预失真值应用于输入信号以产生预失真输入信号 ; （b）放大器，被配置为放大所述预失真输入信号并从其提供输出信号; 以及（c）调整电路，被配置为响应于所述放大器的预定参数值来调整所述预失真函数值的选择。 通过调整预失真功能，放大器在放大器参数值的范围内提供线性功率范围内的输出信号，并避免在预失真信号不可调时可能发生的过补偿。 此外，响应于放大器输入和/或控制参数的变化进行调整，使得放大器能够保持在线性范围内，而不是响应于首先使放大器脱离线性的变化。 这些系统通常包括体现本文公开的一个或多个发明构思的架构，电路或集成电路。 所述方法通常包括以下步骤：（1）根据数字预失真函数预失真输入信号以提供预失真信号，（2）响应于放大器的预定参数值调整数字预失真函数，以及（3） 用放大器放大预失真信号以产生放大信号。