Abstract:
A video processing system may be operable to utilize multi-band sharpening to process luma signals for image signals. The luma signal may be decomposed into a plurality of frequency band components, wherein each component may be processed separately using different sharpening gains and/or offsets. The multi-band processed components may be combined to generate sharpened output luma signals. The multi-band sharpening may be performed utilizing peaking processing, and the input luma signal and/or LTI sharpened luma signals may be combined with the multi-band peaking sharpened signals to generate the sharpened output luma signals. Corresponding chroma signals may also be adjusted to generate sharpened output chroma signals. Luma and/or chroma sharpening operations may be further adjusted based on coring, clipping avoidance, luma statistics, color region detections, and/or curve control parameters. Sharpened output image signals may be generated based on the sharpened output luma signals and the sharpened output chroma signals.
Abstract:
A notebook computer device has a body and a display panel pivotally attached to the body. A receptacle is provided in the body to receive a mobile touch screen telephone in an orientation to present the telephone's touch screen to the user for use as a notebook computer touchpad while viewing the display panel. A display interface is provided for relaying signals from the mobile telephone so that user-manipulation of the touch screen is conveyed to the display panel.
Abstract:
Shallow trench isolation silicon-on-insulator (SOI) devices are formed with improved charge protection. Embodiments include an SOI film diode and a P+ substrate junction as a charging protection device. Embodiments also include a conductive path from the SOI transistor drain, through a conductive contact, a metal line, a second conductive contact, an SOI diode, isolated from the transistor, a third conductive contact, a second conductive line, and a fourth conductive contact to a P+-doped substrate contact in the bulk silicon layer of the SOI substrate.
Abstract:
Shallow trench isolation silicon-on-insulator (SOI) devices are formed with improved charge protection. Embodiments include an SOI film diode and a P+ substrate junction as a charging protection device. Embodiments also include a conductive path from the SOI transistor drain, through a conductive contact, a metal line, a second conductive contact, an SOI diode, isolated from the transistor, a third conductive contact, a second conductive line, and a fourth conductive contact to a P+-doped substrate contact in the bulk silicon layer of the SOI substrate.
Abstract:
Shallow trench isolation silicon-on-insulator (SOI) devices are formed with improved charge protection. Embodiments include an SOI film diode and a P+ substrate junction as a charging protection device. Embodiments also include a conductive path from the SOI transistor drain, through a conductive contact, a metal line, a second conductive contact, an SOI diode, isolated from the transistor, a third conductive contact, a second conductive line, and a fourth conductive contact to a P+-doped substrate contact in the bulk silicon layer of the SOI substrate.
Abstract:
The techniques and technologies described herein relate to the automatic creation of photoresist masks for stress liners used with semiconductor based transistor devices. The stress liner masks are generated with automated design tools that leverage layout data corresponding to features, devices, and structures on the wafer. A resulting stress liner mask (and wafers fabricated using the stress liner mask) defines a stress liner coverage area that extends beyond the boundary of the transistor area and into a stress insensitive area of the wafer. The extended stress liner further enhances performance of the respective transistor by providing additional compressive/tensile stress.
Abstract:
A stress-enhanced semiconductor device is provided which includes a substrate having an inactive region and an active region, a first-type stress layer overlying at least a portion of the active region, and a second-type stress layer. The active region includes a first lateral edge which defines a first width of the active region, and a second lateral edge which defines a second width of the active region. The second-type stress layer is disposed adjacent the second lateral edge of the active region.
Abstract:
A method of detecting damage to at least one dielectric layer in an IC die by determining a capacitance factor. The capacitance factor can be used to determine damage in a low-k dielectric material. A system for detecting damage can include a conductive line structure for measuring capacitance and software or a device for determining the capacitance to determine the damage.
Abstract:
A video processing system may be operable to utilize multi-band sharpening to process luma signals for image signals. The luma signal may be decomposed into a plurality of frequency band components, wherein each component may be processed separately using different sharpening gains and/or offsets. The multi-band processed components may be combined to generate sharpened output luma signals. The multi-band sharpening may be performed utilizing peaking processing, and the input luma signal and/or LTI sharpened luma signals may be combined with the multi-band peaking sharpened signals to generate the sharpened output luma signals. Corresponding chroma signals may also be adjusted to generate sharpened output chroma signals. Luma and/or chroma sharpening operations may be further adjusted based on coring, clipping avoidance, luma statistics, color region detections, and/or curve control parameters. Sharpened output image signals may be generated based on the sharpened output luma signals and the sharpened output chroma signals.
Abstract:
A method and system for performing sample rate conversion is provided. The method may include configuring a system to convert a sample rate of a first audio channel of a plurality of audio channels to produce a first audio stream of samples. The system may be dynamically reconfigured to convert a sample rate of a second of the plurality of audio channels to produce a second audio stream of samples, wherein the first and second audio streams are output from the system at the same time. The method may further include arbitrating between request for additional data from the first and second audio stream of samples, where processing of the first channel is suspended when the request corresponds to a second channel that is of higher priority.