Abstract:
The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).
Abstract:
The invention relates to a micro-machined fluid-flow device (10) comprising a substrate (12) possessing a flow duct (14), a deformable thin layer (18) such a pump membrane or a valve-forming membrane. According to the invention, the thin layer (18) is a rolled metal sheet, preferably made of titanium, and connected to the substrate (12) in the zone (20) overlapping the flow duct, by an anodic bonding. The invention is applicable to making a valve.
Abstract:
The invention relates to a micropump (10; 100) comprising at least a first plate (12), a second plate (20), an intermediate plate (18), a pump chamber (24), and inlet and outlet control members (28, 30). According to the invention, said inlet control member (28) is a non-return valve situated in the major portion of the thickness of said intermediate plate (18), being made of a moving member (40) and a membrane-forming portion (42) situated close to one of the plates (12, 20), connecting said moving member (40) to the remainder of said intermediate plate (18) and, by its resilience, enabling said valve (28) to move between a closed position and an open position, said moving member (40) having an orifice of limited volume passing therethrough.
Abstract:
A micropump including at least one main plate (1), at least one upper plate (2), and a middle plate (3) arranged between the other two plates (1, 2) and forming a pumping chamber (4) that is connected with at least one inlet of the micropump and at least one outlet of the micropump. The pumping chamber comprises a movable wall (5) machined into the middle plate (3); the upper plate is equipped with at least one opening (12) linking a cavity (8) with at least one portion of the movable wall (5). Actuation devices (6, 7, 13) attached to the free surface of the upper plate (2) are used to shift said movable wall (5) in order to bring about a periodic variation in the volume of the pumping chamber (4). According to the invention, the actuating devices (6, 7, 13) are formed by an actuating plate (7) of a material which can be machined so as to define a movable area (11) and said cavity (8). A (sic) intermediate part (13), formed from the upper plate (2), is fastened to the actuating plate (7) (sic) so as to establish contact with the movable wall (5).
Abstract:
The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).
Abstract:
The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).