公开(公告)号：US5340451A

公开(公告)日：1994-08-23

申请号：US61815

申请日：1993-05-13

申请人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  John E. Heidenreich, III ,  Sharon L. Nunes ,  Jae M. Park ,  Richard R. Thomas ,  Domenico Tortorella ,  Luis M. Ferreiro, deceased

发明人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  John E. Heidenreich, III ,  Sharon L. Nunes ,  Jae M. Park ,  Richard R. Thomas ,  Domenico Tortorella ,  Luis M. Ferreiro, deceased

IPC分类号： C23C18/22 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B01D3/00

CPC分类号： C23C18/22 ,  H05K1/034 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381

摘要： A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution.The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.

摘要翻译： 公开了通过使聚合物与等离子体接触，然后与金属盐水溶液接触来制备金属 - 有机聚合物组合的方法。 在一个实施方案中，使用水或一氧化二氮等离子体来处理聚酰亚胺或含氟聚合物。 聚合物与金属阳离子结合，金属是用于常规化学镀的催化剂，之后与用于形成电路的无电金属电镀浴接触，特别是用于在微电路中电镀高纵横比通孔。 与常规的无电镀方法不同，在施加无电镀金属溶液之前，阳离子催化金属不会还原为零价金属催化剂。 该方法还提高聚合物，特别是氟化聚合物的润湿性，并且特别可用于改善高纵横比通孔的润湿性。

公开(公告)号：US5178914A

公开(公告)日：1993-01-12

申请号：US606015

申请日：1990-10-30

申请人： Ronald D. Goldblatt ,  Caroline A. Kovac ,  Domenico Tortorella

发明人： Ronald D. Goldblatt ,  Caroline A. Kovac ,  Domenico Tortorella

IPC分类号： B32B15/088 ,  C08G73/10 ,  C08J5/18 ,  C08J7/12 ,  C09D179/08 ,  C23C18/30 ,  C23C18/31 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

CPC分类号： H05K3/181 ,  C23C18/30 ,  H05K1/0346 ,  H05K3/381

摘要： A method for seeding the surface of a polyimide film which has been generated from a precursor polyamic acid film comprising the steps of: generating a film of polyamic acid on a substance (which may be done by conventional spin coating or by other solution coating techniques well known in the art); then either exposing the polyamic acid film to a solution containing palladium cations; heat-treating the palladium-treated film in a time/temperature schedule that causes imidization of the polymer to occur; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film; or curing the film to the polyimide form; mechanically abrading the film surface, exposing the film to a solution containing palladium cations; exposing the seeded film to an electroless plating bath which causes the deposition of blanket metal film on the surface of the polymer film.

摘要翻译： 一种从前体聚酰胺酸薄膜生成的聚酰亚胺薄膜的表面接种方法，包括以下步骤：在物质上生成聚酰胺酸的膜（可以通过常规旋涂或其它溶液涂覆技术完成） 本领域已知）; 然后将聚酰胺酸膜暴露于含有钯阳离子的溶液中; 在导致聚合物酰亚胺化的时间/温度表中热处理钯处理的膜; 将接种的膜暴露于化学镀浴，其导致在聚合物膜的表面上沉积橡皮布金属膜; 或将膜固化成聚酰亚胺形式; 机械研磨膜表面，将膜暴露于含有钯阳离子的溶液中; 将接种的膜暴露于化学镀浴，其导致覆盖金属膜沉积在聚合物膜的表面上。