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公开(公告)号:USD499064S1
公开(公告)日:2004-11-30
申请号:US29190086
申请日:2003-09-16
申请人: Jarad W. Hall , Donald Lariviere , Thomas H. Kim
设计人: Jarad W. Hall , Donald Lariviere , Thomas H. Kim
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公开(公告)号:USD493399S1
公开(公告)日:2004-07-27
申请号:US29190048
申请日:2003-09-16
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公开(公告)号:USD489304S1
公开(公告)日:2004-05-04
申请号:US29190094
申请日:2003-09-16
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公开(公告)号:USD513215S1
公开(公告)日:2005-12-27
申请号:US29217025
申请日:2004-11-12
申请人: Jarad W. Hall , Donald Lariviere , Thomas H. Kim , David Edwards
设计人: Jarad W. Hall , Donald Lariviere , Thomas H. Kim , David Edwards
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公开(公告)号:USD508445S1
公开(公告)日:2005-08-16
申请号:US29211981
申请日:2004-08-25
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公开(公告)号:USD508440S1
公开(公告)日:2005-08-16
申请号:US29210378
申请日:2004-08-02
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公开(公告)号:USD502903S1
公开(公告)日:2005-03-15
申请号:US29190097
申请日:2003-09-16
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公开(公告)号:USD494105S1
公开(公告)日:2004-08-10
申请号:US29190103
申请日:2003-09-19
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公开(公告)号:USD826441S1
公开(公告)日:2018-08-21
申请号:US29429631
申请日:2012-08-14
申请人: Mark W. Fuller , Tom Cuda , Donald Lariviere , Antonio Layon , Scott Winslow , Boris Karpichev
设计人: Mark W. Fuller , Tom Cuda , Donald Lariviere , Antonio Layon , Scott Winslow , Boris Karpichev
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公开(公告)号:US20130170212A1
公开(公告)日:2013-07-04
申请号:US13728781
申请日:2012-12-27
申请人: Tom Cuda , Graham Baskett , Donald Lariviere , Boris Karpichev , Mark W. Fuller , John Canavan , Scott Winslow , Antonio Layon
发明人: Tom Cuda , Graham Baskett , Donald Lariviere , Boris Karpichev , Mark W. Fuller , John Canavan , Scott Winslow , Antonio Layon
CPC分类号: F21V29/74 , F21V5/00 , F21V5/048 , F21V21/40 , F21V23/009 , F21V23/02 , F21V29/00 , F21V29/507 , F21V29/508 , F21V29/51 , F21V29/71 , F21V29/76 , F21V29/77 , F21V29/83 , F21V29/89 , F21V31/005 , F21W2131/401 , F21Y2113/00 , F21Y2115/10
摘要: Underwater LED lights with enhanced cooling to allow the use of substantial numbers of high power LEDs. In all embodiments, the majority of the heat given off by the LEDs is transferred to the housing of the underwater light by heat transfer techniques other than by convection of the air or other gases within the enclosure, providing direct heat conveyance from the LEDs to or through the light enclosure walls, by conduction through a thermal conductor or by or as augmented by heat pipes to the inside wall of the enclosure or through the wall of the enclosure to the water. Various embodiments are disclosed.
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