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1.发明授权
公开(公告)号：US6024266A
公开(公告)日：2000-02-15
申请号：US179862
申请日：1998-10-28
CPC分类号： B65H23/26 , B65H23/24 , B65H2401/242 , B65H2404/621 , B65H2406/111 , H05K3/005
摘要： One or more porous air film rolls are used, in a system to support a flexible web during movement of the web, and selectively provide either compliant or rigid clamping of the web while performing processing operations on the web at a work station. The present invention is particularly suitable for punching holes on-the-fly, in both "X" and "Y" directions, in a flexible polyamide film. Up to a four-fold increase in punch tool productivity is provided by the present invention.
摘要翻译： 在一个系统中使用一个或多个多孔空气薄膜辊，以便在幅材移动期间支撑柔性幅材，并且在工作站处对幅材进行处理操作时选择性地提供纸幅的顺从或刚性夹紧。 本发明特别适用于在柔性聚酰胺薄膜中，在“X”和“Y”方向上均匀地冲孔。 本发明提供了冲压工具生产率提高4倍。
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2.发明授权Method and apparatus for establishing a solder bond to a solder ball grid array 失效用于建立与焊球栅格阵列的焊接接合的方法和装置
公开(公告)号：US5902495A
公开(公告)日：1999-05-11
申请号：US734934
申请日：1996-10-22
申请人： Edward J. Burke , Donald Wesley Henderson , Lawrence Philip Lehman , Daniel C. Webster, deceased
发明人： Edward J. Burke , Donald Wesley Henderson , Lawrence Philip Lehman , Daniel C. Webster, deceased
CPC分类号： B23K1/00 , B23K3/025 , B23K3/033 , B23K3/0338 , H05K3/3478 , H05K3/3494
摘要： Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid array, a transducer for measuring displacement of the bonding tip during the bonding operation, and a signal generator responsive to the transducer for providing a signal indicative of tip displacement. The signal generated by the signal generator may be fed back to the bonding tool to optimize bonding parameters.
摘要翻译： 用于在焊球栅格阵列和安装在基板上的电路之间建立焊接结合的装置和方法包括具有用于向焊球栅格阵列中的一个或多个焊球的位置施加热量的接合末端的接合工具， 用于测量接合操作期间接合尖端的位移的传感器，以及响应于换能器的信号发生器，用于提供指示尖端位移的信号。 由信号发生器产生的信号可被反馈到接合工具以优化接合参数。
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公开(公告)号：US5957360A
公开(公告)日：1999-09-28
申请号：US008803
申请日：1998-01-16
CPC分类号： B65H23/26 , B65H23/24 , B65H2401/242 , B65H2404/621 , B65H2406/111 , H05K3/005
摘要： One or more porous air film rolls are used, in a system to support a flexible web during movement of the web, and selectively provide either compliant or rigid clamping of the web while performing processing operations on the web at a work station. The present invention is particularly suitable for punching holes on-the-fly, in both "X" and "Y" directions, in a flexible polyamide film. Up to a four-fold increase in punch tool productivity is provided by the present invention.
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