公开(公告)号：US08864376B2

公开(公告)日：2014-10-21

申请号：US13334314

申请日：2011-12-22

Applicant: Kwang-Seok Kim ,  Seong-Ook Jung ,  Seung-Han Woo ,  Kyung-Ho Ryu ,  Dong-Hoon Jung

Inventor： Kwang-Seok Kim ,  Seong-Ook Jung ,  Seung-Han Woo ,  Kyung-Ho Ryu ,  Dong-Hoon Jung

IPC: G01K7/34

CPC classification number: G01K7/346

Abstract: A temperature sensing circuit includes a signal generation unit including a delay line and generating a source signal with a pulse width corresponding to a delay value of the delay line, a pulse width expansion unit configured to generate a comparison signal by expanding a pulse width of the source signal, and a change detection unit configured to sense a temperature change using a difference between the pulse widths of the comparison signal and a reference signal.

Abstract translation: 温度检测电路包括：信号生成单元，包括延迟线，并产生具有与延迟线的延迟值相对应的脉冲宽度的源极信号;脉冲宽度扩展单元，被配置为通过扩展所述延迟线的脉冲宽度来生成比较信号 源信号，以及变更检测单元，被配置为使用比较信号的脉冲宽度与参考信号之间的差来感测温度变化。

公开(公告)号：US06896743B2

公开(公告)日：2005-05-24

申请号：US10041227

申请日：2002-01-08

Applicant: Jae-Hyung Jung ,  Young-Min Kwon ,  Jong-Jae Lee ,  Dong-Hoon Jung

Inventor： Jae-Hyung Jung ,  Young-Min Kwon ,  Jong-Jae Lee ,  Dong-Hoon Jung

IPC: H01L21/304 ,  H01L21/00 ,  B08B3/00 ,  F26B3/06

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

Abstract translation: 晶片干燥方法包括将晶片浸没在干燥室中的清洁溶液中。 来自有机液体的有机液体蒸气以第一体积供应速率供应到干燥室中，以在清洁溶液的表面上形成有机液体层，有机液体层至少具有规定浓度的有机液体。 有机液体蒸气以低于第一体积供应速率的第二体积供应速率供应到干燥室中。 在将有机液体蒸气供应到干燥室中和/或之后，晶片的至少一部分通过有机液体层从清洗溶液中除去。

公开(公告)号：US07343922B2

公开(公告)日：2008-03-18

申请号：US11103802

申请日：2005-04-12

Applicant: Jae-Hyung Jung ,  Young-Min Kwon ,  Jong-Jae Lee ,  Dong-Hoon Jung

Inventor： Jae-Hyung Jung ,  Young-Min Kwon ,  Jong-Jae Lee ,  Dong-Hoon Jung

IPC: B08B5/00 ,  F26B19/00

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

Abstract translation: 晶片干燥方法包括将晶片浸没在干燥室中的清洁溶液中。 来自有机液体的有机液体蒸气以第一体积供应速率供应到干燥室中，以在清洁溶液的表面上形成有机液体层，有机液体层至少具有规定浓度的有机液体。 有机液体蒸气以低于第一体积供应速率的第二体积供应速率供应到干燥室中。 在将有机液体蒸气供应到干燥室中和/或之后，晶片的至少一部分通过有机液体层从清洗溶液中除去。

公开(公告)号：US20060174913A1

公开(公告)日：2006-08-10

申请号：US11322389

申请日：2006-01-03

Applicant: Dong-hoon Jung ,  Jong-jae Lee ,  Seung-kun Lee ,  Man-young Lee

Inventor： Dong-hoon Jung ,  Jong-jae Lee ,  Seung-kun Lee ,  Man-young Lee

IPC: C23G1/00 ,  B08B9/20 ,  B08B3/00

CPC classification number: H01L21/67057

Abstract: A wet processing apparatus includes a bath in which a plurality of semiconductor substrates are to be seated, and which bath has drain valves defining drain openings between a bottom wall and the lower portions of side walls of the bath. Each of the drain valves also includes a gate mounted on the lower portion of one of the side walls. The gates of the drain valves are movable to selectively open and close the drain openings. A plurality of substrates are transferred into the bath and are held under a body of liquid contained in a bath while the substrates are oriented vertically as disposed generally parallel to one another. In this state, the side walls of the baths face the peripheral edges of the substrates at both sides of the substrates. Thus, the substrates are prevented from moving toward and becoming stuck to one another when the liquid is drained from the bath.

Abstract translation: 湿处理设备包括其中要安置多个半导体衬底的浴，以及哪个浴具有排泄阀，该排水阀在底壁和浴的侧壁的下部之间形成排水开口。 每个排水阀还包括安装在一个侧壁的下部上的门。 排水阀的闸门可移动以选择性地打开和关闭排水口。 将多个基板转移到浴中并且被保持在包含在浴中的液体的主体下，同时基板垂直定向，大体上彼此平行地设置。 在这种状态下，浴的侧壁在基板的两侧面对基板的周边边缘。 因此，当液体从浴中排出时，防止基板移动并相互粘合。

公开(公告)号：US20050211266A1

公开(公告)日：2005-09-29

申请号：US11103802

申请日：2005-04-12

Applicant: Jae-Hyung Jung ,  Young-Min Kwon ,  Jong-Jae Lee ,  Dong-Hoon Jung

Inventor： Jae-Hyung Jung ,  Young-Min Kwon ,  Jong-Jae Lee ,  Dong-Hoon Jung

IPC: H01L21/304 ,  H01L21/00 ,  B08B3/04

CPC classification number: H01L21/67034 ,  Y10S134/902

Abstract: A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

Abstract translation: 晶片干燥方法包括将晶片浸没在干燥室中的清洁溶液中。 来自有机液体的有机液体蒸气以第一体积供应速率供应到干燥室中，以在清洁溶液的表面上形成有机液体层，有机液体层至少具有规定浓度的有机液体。 有机液体蒸气以低于第一体积供应速率的第二体积供应速率供应到干燥室中。 在将有机液体蒸气供应到干燥室中和/或之后，晶片的至少一部分通过有机液体层从清洗溶液中除去。

公开(公告)号：US20120189033A1

公开(公告)日：2012-07-26

申请号：US13334314

申请日：2011-12-22

Applicant: Kwang-Seok KIM ,  Seong-Ook Jung ,  Seung-Han Woo ,  Kyung-Ho Ryu ,  Dong-Hoon Jung

Inventor： Kwang-Seok KIM ,  Seong-Ook Jung ,  Seung-Han Woo ,  Kyung-Ho Ryu ,  Dong-Hoon Jung

IPC: G01K7/00

CPC classification number: G01K7/346

Abstract: A temperature sensing circuit includes a signal generation unit including a delay line and generating a source signal with a pulse width corresponding to a delay value of the delay line, a pulse width expansion unit configured to generate a comparison signal by expanding a pulse width of the source signal, and a change detection unit configured to sense a temperature change using a difference between the pulse widths of the comparison signal and a reference signal.

Abstract translation: 温度检测电路包括：信号生成单元，包括延迟线，并产生具有与延迟线的延迟值相对应的脉冲宽度的源极信号;脉冲宽度扩展单元，被配置为通过扩展所述延迟线的脉冲宽度来生成比较信号 源信号，以及变更检测单元，被配置为使用比较信号的脉冲宽度与参考信号之间的差来感测温度变化。