公开(公告)号：US20050112292A1

公开(公告)日：2005-05-26

申请号：US10722950

申请日：2003-11-25

申请人： Russell Parker ,  Duan Dutton ,  Nelson Holcomb

发明人： Russell Parker ,  Duan Dutton ,  Nelson Holcomb

IPC分类号： B05D3/04 ,  C23C16/00 ,  G01N33/543

CPC分类号： G01N33/54393

摘要： Methods for treating at least one member of a backing element/microarray assembly structure are provided. The subject methods include at least one of: (1) depositing a component on the at least one member, (2) extracting a component from the at least one member, and (3) surface modifying the at least one member, to treat the at least one member of a backing element/microarray assembly structure. Embodiments of the subject invention also include treated microarray structure members, e.g., produced in accordance with the subject methods, as well as methods for using treated microarray structure members in array assay protocols. Also provided are systems and kits for use in the subject methods.

摘要翻译： 提供了用于处理背衬元件/微阵列组装结构的至少一个构件的方法。 主题方法包括以下中的至少一个：（1）在至少一个构件上沉积组分，（2）从至少一个构件提取组分，和（3）表面修饰至少一个构件，以处理 背衬元件/微阵列组件结构的至少一个构件。 本发明的实施方案还包括经处理的微阵列结构构件，例如根据本发明方法制备的，以及在阵列测定方案中使用经处理的微阵列结构构件的方法。 还提供了用于主题方法的系统和套件。