公开(公告)号：US5481899A

公开(公告)日：1996-01-09

申请号：US245381

申请日：1994-06-27

Applicant: Guy Harris ,  Duane Callaway ,  Rajesh Shah

Inventor： Guy Harris ,  Duane Callaway ,  Rajesh Shah

IPC: H01L21/60 ,  B21J9/18

CPC classification number: H01L24/50 ,  H01L24/86 ,  H01L2924/01082 ,  Y10T29/49121 ,  Y10T29/53178

Abstract: The edges of a semiconductor die are moved away from the lead frame leads attached to the die by using a pressure differential across the semiconductor die.

Abstract translation: 半导体管芯的边缘通过使用半导体管芯上的压差而远离附接到管芯的引线框引线。

公开(公告)号：US5338705A

公开(公告)日：1994-08-16

申请号：US943278

申请日：1992-09-10

Applicant: Guy Harris ,  Duane Callaway ,  Rajesh Shah

Inventor： Guy Harris ,  Duane Callaway ,  Rajesh Shah

IPC: H01L21/60

CPC classification number: H01L24/50 ,  H01L24/86 ,  H01L2924/01082 ,  Y10T29/49121 ,  Y10T29/53178

Abstract: The edges of a semiconductor die are moved away from the lead frame leads attached to the die by using a pressure differential across the semiconductor die.

Abstract translation: 半导体管芯的边缘通过使用半导体管芯上的压差而远离附接到管芯的引线框引线。