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    RESERVOIR FOR DUAL LOOP LUBRICATION AND THERMAL MANAGEMENT SYSTEM FOR PUMPS
    2.
    发明公开
    RESERVOIR FOR DUAL LOOP LUBRICATION AND THERMAL MANAGEMENT SYSTEM FOR PUMPS 审中-公开

    公开(公告)号：US20240077073A1

    公开(公告)日：2024-03-07

    申请号：US17901725

    申请日：2022-09-01

    Applicant: EKU POWER DRIVES INC.

    Inventor： Benedikt Peter ZIER

    IPC: F04B53/08 ,  F04B53/18

    CPC classification number: F04B53/08 ,  F04B53/18

    Abstract: A device including a reservoir configured to contain a lubricant. One or more sets of baffles are disposed in the reservoir. The one or more sets of baffles separate the reservoir into a hot zone and a cold zone. The one or more sets of baffles permit at least some flow of the lubricant between the hot zone and the cold zone. The device also includes a machine loop drain placed in the reservoir to drain lubricant returning from a machine into the hot zone. The device also includes a thermal management loop drain placed in the reservoir to drain lubricant returning from a thermal management system into the cold zone. The device also includes a thermal management loop inlet placed in the reservoir to draw lubricant from the hot zone. The device also includes a machine loop inlet placed in the reservoir to draw lubricant from the cold zone.

    Dual loop lubrication and thermal management system for pumps
    3.
    发明授权
    Dual loop lubrication and thermal management system for pumps 有权

    公开(公告)号：US11920585B1

    公开(公告)日：2024-03-05

    申请号：US17901737

    申请日：2022-09-01

    Applicant: EKU POWER DRIVES INC.

    Inventor： Levi Wayne Beck ,  Benedikt Peter Zier ,  Andreas Pfister

    IPC: F04B53/18 ,  F04B53/08 ,  F04B53/20 ,  F04B47/00

    CPC classification number: F04B53/18 ,  F04B53/08 ,  F04B53/20 ,  F04B47/00 ,  F04B2205/06

    Abstract: A device including a reservoir configured to receive a lubricant from a machine lubricated with the lubricant. The device also includes a pressure equalizer connected to the reservoir. The device also includes a first loop comprising a first line system through which the lubricant flows between the machine and the reservoir. The lubricant within the first loop is at a first pressure. The device also includes a temperature regulation system configured to regulate a temperature of the lubricant. The device also includes a second loop comprising a second line system through which the lubricant flows between the temperature regulation system and the reservoir. The lubricant within the second loop is at a second pressure that is less than the first pressure. The second loop is separate from the first loop.

    DUAL LOOP LUBRICATION AND THERMAL MANAGEMENT SYSTEM FOR PUMPS
    4.
    发明公开
    DUAL LOOP LUBRICATION AND THERMAL MANAGEMENT SYSTEM FOR PUMPS 审中-公开

    公开(公告)号：US20240077074A1

    公开(公告)日：2024-03-07

    申请号：US17901737

    申请日：2022-09-01

    Applicant: EKU POWER DRIVES INC.

    Inventor： Levi Wayne BECK ,  Benedikt Peter ZIER ,  Andreas PFISTER

    IPC: F04B53/18 ,  F04B53/08 ,  F04B53/20

    CPC classification number: F04B53/18 ,  F04B53/08 ,  F04B53/20 ,  F04B47/00

    Abstract: A device including a reservoir configured to receive a lubricant from a machine lubricated with the lubricant. The device also includes a pressure equalizer connected to the reservoir. The device also includes a first loop comprising a first line system through which the lubricant flows between the machine and the reservoir. The lubricant within the first loop is at a first pressure. The device also includes a temperature regulation system configured to regulate a temperature of the lubricant. The device also includes a second loop comprising a second line system through which the lubricant flows between the temperature regulation system and the reservoir. The lubricant within the second loop is at a second pressure that is less than the first pressure. The second loop is separate from the first loop.

    Reservoir for dual loop lubrication and thermal management system for pumps
    5.
    发明授权
    Reservoir for dual loop lubrication and thermal management system for pumps 有权

    公开(公告)号：US12188468B2

    公开(公告)日：2025-01-07

    申请号：US17901725

    申请日：2022-09-01

    Applicant: EKU POWER DRIVES INC.

    Inventor： Benedikt Peter Zier

    IPC: F04B53/08 ,  F04B53/18

    Abstract: A device including a reservoir configured to contain a lubricant. One or more sets of baffles are disposed in the reservoir. The one or more sets of baffles separate the reservoir into a hot zone and a cold zone. The one or more sets of baffles permit at least some flow of the lubricant between the hot zone and the cold zone. The device also includes a machine loop drain placed in the reservoir to drain lubricant returning from a machine into the hot zone. The device also includes a thermal management loop drain placed in the reservoir to drain lubricant returning from a thermal management system into the cold zone. The device also includes a thermal management loop inlet placed in the reservoir to draw lubricant from the hot zone. The device also includes a machine loop inlet placed in the reservoir to draw lubricant from the cold zone.

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