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公开(公告)号:US6135586A
公开(公告)日:2000-10-24
申请号:US551266
申请日:1995-10-31
申请人: Paul H. McClelland , Douglas A. Sexton , Kit Baughman , Marvin G. Wong , Eldurkar Bhaskar , Marzio Leban
发明人: Paul H. McClelland , Douglas A. Sexton , Kit Baughman , Marvin G. Wong , Eldurkar Bhaskar , Marzio Leban
CPC分类号: B41J2/155 , B41J2/14024
摘要: A pagewide printhead for an inkjet printer employs a stretch-to-fit flex circuit with orifices indexed to reference indentations on the flex circuit. Heater resistors disposed on a block of thermally stable insulating material are indexed to reference features accurately located on the block. The reference indentations are fitted to the reference indentations to provide accurate registration of the orifices to the heater resistors.
摘要翻译: 用于喷墨打印机的页面广泛的打印头采用拉伸拟合柔性电路,其具有索引的孔口以便在柔性电路上引用压痕。 设置在热稳定绝缘材料块上的加热电阻器被索引到准确地位于块上的参考特征。 参考压痕适用于参考压痕,以便将加热器电阻器的孔精确对准。
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公开(公告)号:US5167776A
公开(公告)日:1992-12-01
申请号:US686077
申请日:1991-04-16
CPC分类号: C25D1/08 , B41J2/162 , B41J2/1625
摘要: A new and improved orifice or nozzle plate for an inkjet printhead and method of manufacture wherein the orifice or nozzle plate thickness has been increased significantly to a value on the order of 75 micrometers or greater while simultaneously maintaining the integrity of the convergent contour of the multiple orifice openings formed therein. In a first embodiment of this invention, metal layer stacking through the use of successive electroforming processes is used to achieve a desired orifice plate structure, architecture and convergent orifice geometry. In a second embodiment of this invention, anisotropic electroplating on a metal surface and over the edges of an inorganic dielectric mask is used to produce this orifice plate of increased orifice bore thickness and convergent orifice bore geometry. In yet a third embodiment of the invention, a selected metal is plated upon a permanent insulating mandrel having a metal pattern thereon to form convergent orifice openings in the plated metal. Openings are then formed in the insulating layer which are aligned with electroplated convergent openings in the metal layer to thereby form a composite metal-insulator orifice plate of increased thickness and overall convergent orifice bore geometry.
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