公开(公告)号：US20060027522A1

公开(公告)日：2006-02-09

申请号：US10914576

申请日：2004-08-09

申请人： John Martin ,  Manolo Mena ,  Elmer Lacsamana ,  Michael Duffy ,  William Webster ,  Lawrence Felton ,  Maurice Karpman

发明人： John Martin ,  Manolo Mena ,  Elmer Lacsamana ,  Michael Duffy ,  William Webster ,  Lawrence Felton ,  Maurice Karpman

IPC分类号： C23F1/00 ,  H01L21/302

CPC分类号： B81C1/00896

摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.