公开(公告)号：US08723308B2

公开(公告)日：2014-05-13

申请号：US13299129

申请日：2011-11-17

申请人： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Rick Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

发明人： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Rick Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC分类号： H04B1/06

CPC分类号： H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

摘要翻译： 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。

公开(公告)号：US20060027522A1

公开(公告)日：2006-02-09

申请号：US10914576

申请日：2004-08-09

申请人： John Martin ,  Manolo Mena ,  Elmer Lacsamana ,  Michael Duffy ,  William Webster ,  Lawrence Felton ,  Maurice Karpman

发明人： John Martin ,  Manolo Mena ,  Elmer Lacsamana ,  Michael Duffy ,  William Webster ,  Lawrence Felton ,  Maurice Karpman

IPC分类号： C23F1/00 ,  H01L21/302

CPC分类号： B81C1/00896

摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

公开(公告)号：US20120126347A1

公开(公告)日：2012-05-24

申请号：US13299129

申请日：2011-11-17

申请人： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

发明人： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC分类号： H01L23/10 ,  H01L23/06 ,  H01L21/50 ,  H01L29/84 ,  H01L21/52

CPC分类号： H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

摘要： Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

摘要翻译： 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。