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公开(公告)号：US4282454A
公开(公告)日：1981-08-04
申请号：US33774
申请日：1979-04-27
CPC分类号： H03H9/0519 , H01L41/29 , Y10T29/42 , Y10T29/49179
摘要： A crystal is mounted on a low, centrally located pedestal. Connections to the lower side of the crystal are made by way of conductive areas on the pedestal. Multiple wiring connections are made at the edges of the crystal by allowing the bonding tool to depress the edge of the crystal so that the crystal bonding pad is supported by the base structure only during the bonding process, then released thereafter to allow free vibration of the crystal plate. Complex circuitry, possibly involving more than one frequency can thus be put onto one plate.
摘要翻译： 一个晶体安装在低位于中央的基座上。 与晶体下侧的连接是通过基座上的导电区域制成的。 通过允许接合工具压下晶体的边缘，在晶体的边缘处进行多个接线连接，使得晶体接合焊盘仅在接合过程期间由基底结构支撑，然后释放以允许晶体的自由振动 水晶板。 因此，可能涉及多于一个频率的复杂电路可以放在一个板上。
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公开(公告)号：US4334343A
公开(公告)日：1982-06-15
申请号：US180761
申请日：1980-08-25
CPC分类号： H03H9/0519 , H01L41/29 , Y10T29/42 , Y10T29/49179
摘要： A crystal is mounted on a low, centrally located pedestal. Connections to the lower side of the crystal are made by way of conductive areas on the pedestal. Multiple wiring connections are made at the edges of the crystal by allowing the bonding tool to depress the edge of the crystal so that the crystal bonding pad is supported by the base structure only during the bonding process, then released thereafter to allow free vibration of the crystal plate. Complex circuitry, possibly involving more than one frequency can thus be put onto one plate.
摘要翻译： 一个晶体安装在低位于中央的基座上。 与晶体下侧的连接是通过基座上的导电区域制成的。 通过允许接合工具压下晶体的边缘，在晶体的边缘处进行多个接线连接，使得晶体接合焊盘仅在接合过程期间由基体结构支撑，然后释放以允许晶体的自由振动 水晶板。 因此，可能涉及多于一个频率的复杂电路可以放在一个板上。
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