公开(公告)号：US20130134126A1

公开(公告)日：2013-05-30

申请号：US13701788

申请日：2011-06-03

申请人： Dorota Kowal-Paul ,  Enrico Bellmann ,  Oisin Kenny ,  Stefan Ruckmich

发明人： Dorota Kowal-Paul ,  Enrico Bellmann ,  Oisin Kenny ,  Stefan Ruckmich

IPC分类号： H05K13/00

CPC分类号： H05K13/00 ,  H01L21/6835 ,  H01L2221/6835 ,  H01L2221/68386

摘要： A technique, comprising defining at least part of one or more electronic devices on a substrate sheet by means of one or more material removal processes, wherein the substrate sheet is arranged on a lower layer so as to overhang said lower layer more at a first end than it does at an opposite, second end; and removing loose material from under said overhang at said first end by means of a stream of gas directed at said substrate and said lower layer from an outlet, said stream of gas having at said outlet at least a directional component parallel to a direction from said second end to said first end.

摘要翻译： 一种技术，其包括通过一个或多个材料去除工艺在衬底片上限定一个或多个电子器件的至少一部分，其中所述衬底布置在下层上，以便在第一端更多地伸出所述下层 而不是在相反的第二端; 并且在所述第一端处通过从所述基底和所述下层排出的气流从所述出口除去在所述突出部下方的松散材料，所述气体流在所述出口处具有至少一个平行于所述第一端的方向的方向分量 第二端到所述第一端。