公开(公告)号：US20070070601A1

公开(公告)日：2007-03-29

申请号：US11236471

申请日：2005-09-27

申请人： David Vos ,  Randall Stutzman ,  Jon Larcheveque ,  Eugene Urda

发明人： David Vos ,  Randall Stutzman ,  Jon Larcheveque ,  Eugene Urda

IPC分类号： H05K7/20

CPC分类号： H05K7/1404 ,  H05K7/20563

摘要： A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.

摘要翻译： 冷却组件位于具有传导冷却电路模块的底盘中，并且允许传导冷却的电路模块用于空气流通或液体流通的电路模块底盘组件中。 冷却组件可以是可拆卸的冷却适配器，或者可以与底盘一体。 冷却组件包括具有第一端和第二端并限定一个或多个流体通道的壳体。 壳体还包括与传导冷却电路模块接触的热接触表面。 冷却组件可以被配置为用于传导冷却电路模块的空气流通或液体流通冷却。