公开(公告)号：US06552266B2

公开(公告)日：2003-04-22

申请号：US09770913

申请日：2001-01-26

申请人： Timothy F. Carden ,  Glenn O. Dearing ,  Kishor V. Desai ,  Stephen R. Engle ,  Randall Stutzman ,  George H. Thiel

发明人： Timothy F. Carden ,  Glenn O. Dearing ,  Kishor V. Desai ,  Stephen R. Engle ,  Randall Stutzman ,  George H. Thiel

IPC分类号： H01L2302

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169

摘要： A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.

公开(公告)号：US20070070601A1

公开(公告)日：2007-03-29

申请号：US11236471

申请日：2005-09-27

申请人： David Vos ,  Randall Stutzman ,  Jon Larcheveque ,  Eugene Urda

发明人： David Vos ,  Randall Stutzman ,  Jon Larcheveque ,  Eugene Urda

IPC分类号： H05K7/20

CPC分类号： H05K7/1404 ,  H05K7/20563

摘要： A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.

摘要翻译： 冷却组件位于具有传导冷却电路模块的底盘中，并且允许传导冷却的电路模块用于空气流通或液体流通的电路模块底盘组件中。 冷却组件可以是可拆卸的冷却适配器，或者可以与底盘一体。 冷却组件包括具有第一端和第二端并限定一个或多个流体通道的壳体。 壳体还包括与传导冷却电路模块接触的热接触表面。 冷却组件可以被配置为用于传导冷却电路模块的空气流通或液体流通冷却。

公开(公告)号：US06552264B2

公开(公告)日：2003-04-22

申请号：US09041580

申请日：1998-03-11

申请人： Timothy F. Carden ,  Glenn O. Dearing ,  Kishor V. Desai ,  Stephen R. Engle ,  Randall Stutzman ,  George H. Thiel

发明人： Timothy F. Carden ,  Glenn O. Dearing ,  Kishor V. Desai ,  Stephen R. Engle ,  Randall Stutzman ,  George H. Thiel

IPC分类号： H01L2302

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169

摘要： A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board.

摘要翻译： 公开了一种芯片载体封装，其包括通过可回流接合材料附接到加强件的盖板。 此外，可以包括在盖板和芯片本身之间的导热和导电的接合材料。 还有一种芯片封装，其包括对准装置，以帮助正确对准加强件上的盖板。 此外，一种包装芯片的方法，包括在盖板和加强体之间提供可回流材料，用于将盖板附接到加强件，并且同时将盖板附接到加强件，并将托架附接到电子电路板。

公开(公告)号：US06655020B2

公开(公告)日：2003-12-02

申请号：US09770915

申请日：2001-01-26

申请人： Timothy F. Carden ,  Glenn O. Dearing ,  Kishor V. Desai ,  Stephen R. Engle ,  Randall Stutzman ,  George H. Thiel

发明人： Timothy F. Carden ,  Glenn O. Dearing ,  Kishor V. Desai ,  Stephen R. Engle ,  Randall Stutzman ,  George H. Thiel

IPC分类号： H05K334

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169

摘要： A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material between the cover plate and the chip itself may be included. Also a chip package including an alignment device to aid in properly aligning the cover plate on the stiffener is disclosed. Furthermore, a method of packaging a chip including providing a reflowable material between the cover plate and stiffener body for attaching the cover plate to the stiffener, and simultaneously attaching the cover plate to the stiffener with an attaching of the carrier to an electronic circuit board is disclosed.

摘要翻译： 公开了一种芯片载体封装，其包括通过可回流接合材料附接到加强件的盖板。 此外，可以包括在盖板和芯片本身之间的导热和导电的接合材料。 还公开了一种包括对准装置以帮助正确对准加强件上的盖板的芯片封装。 此外，一种包装芯片的方法，包括在盖板和加强体之间提供可回流材料，用于将盖板附接到加强件，并且将托架附接到电子电路板上同时将盖板附接到加强件， 披露