摘要:
Structure and method for metallization patterns of different thicknesses on a semiconductor device or integrated circuit. The improved structure and method utilizes three layers of metal in order to reduce the required number of processing steps. One preferred embodiment entails a single metal deposition sequence followed by two etch steps, while a second embodiment, suitable for thicker metallization, requires only two depositions and two etch steps.
摘要:
A transparent photochromic article including a transparent substrate including a photochromic material; and an anti-reflection surface coating thereon, produced with a plurality of overlapping layers incorporating, alternatively a first and second material having respectively higher and lower refractive indices, the anti-reflection coating including; a first layer including said first material having an optical thickness of about 20 to 45 nm; a second layer including said second material having an optical thickness of about 25 to 45 nm; a third layer including said first material having an optical thickness of about 220 to 250 nm; and a fourth layer including said second material having an optical thickness of about 95-115 nm.