公开(公告)号：US20230110672A1

公开(公告)日：2023-04-13

申请号：US17500613

申请日：2021-10-13

Applicant: GM Global Technology Operations LLC ,  Ftech R&D North America Inc.

Inventor： Balbir Singh Sangha ,  Len V. Peschansky ,  Manish Pamwar ,  Fred M. Marquardt ,  William R. Rodgers ,  Bruce N. Greve ,  David Kennedy ,  Adrian Bica ,  Bikramjit Sarkaria

IPC: B62D29/00 ,  B62D25/00

Abstract: A chassis assembly having mixed material for reduced mass is provided. The assembly comprises an upper structure comprised of metal. The upper structure has a plurality of first bond surfaces, each of which is parallel with each other at varying elevations relative to a z-axis of a 3-dimensional coordinate thereof. The assembly further comprises a lower structure made of a polymer composite. The lower structure has a plurality of second bond surfaces, each of which is parallel with each other at varying elevations relative to the z-axis thereof. The second bond surfaces are arranged to align with the first bond surfaces in complementing relation such that the lower structure is joined with the upper structure at the first and second bond surfaces. The assembly further comprises an adhesive disposed between the first and second bond surfaces to join the lower and upper structures at the first and second bond surfaces, defining a bond gap between the first and second bond surfaces.

公开(公告)号：US11724746B2

公开(公告)日：2023-08-15

申请号：US17500613

申请日：2021-10-13

Applicant: GM Global Technology Operations LLC ,  Ftech R&D North America Inc.

Inventor： Balbir Singh Sangha ,  Len V. Peschansky ,  Manish Pamwar ,  Fred M. Marquardt ,  William R. Rodgers ,  Bruce N. Greve ,  David Kennedy ,  Adrian Bica ,  Bikramjit Sarkaria

IPC: B62D21/00 ,  B62D25/00

CPC classification number: B62D25/00 ,  B62D21/00

Abstract: A chassis assembly having mixed material for reduced mass is provided. The assembly comprises an upper structure comprised of metal. The upper structure has a plurality of first bond surfaces, each of which is parallel with each other at varying elevations relative to a z-axis of a 3-dimensional coordinate thereof. The assembly further comprises a lower structure made of a polymer composite. The lower structure has a plurality of second bond surfaces, each of which is parallel with each other at varying elevations relative to the z-axis thereof. The second bond surfaces are arranged to align with the first bond surfaces in complementing relation such that the lower structure is joined with the upper structure at the first and second bond surfaces. The assembly further comprises an adhesive disposed between the first and second bond surfaces to join the lower and upper structures at the first and second bond surfaces, defining a bond gap between the first and second bond surfaces.