公开(公告)号：US4419807A

公开(公告)日：1983-12-13

申请号：US239536

申请日：1981-03-02

申请人： Georges Moulin

发明人： Georges Moulin

IPC分类号： B23Q3/155 ,  B23Q3/157

CPC分类号： B23Q3/15766 ,  B23Q3/15526 ,  B23Q3/1554 ,  B23Q3/15706 ,  Y10T408/37 ,  Y10T483/1809 ,  Y10T483/1818 ,  Y10T483/1882

摘要： A tool change device, for transferring selected tools between a rotary tool magazine and the rotary spindle of a machine tool. The magazine has a plurality of sector-shaped tool holders, in each of which one tool is stored. Tools are individually loaded or unloaded at a corresponding orientation of the magazine, at which a selected sector-shaped tool holder is in axial alignment with the machine spindle. When in such alignment, the sector-shaped tool holder is moved axially into cooperative relationship with the spindle and tool transfer is effected. Means are provided to lock each of the sector-shaped tool holders into an inactive axial storage position, except when selected.

摘要翻译： 一种刀具更换装置，用于在旋转刀库与机床的旋转主轴之间传送所选刀具。 该杂志具有多个扇形工具架，其中每一个都保存有一个工具。 刀具在刀库的相应方向上单独加载或卸载，在该刀库处，所选择的扇形刀架与机床主轴对准。 当处于这种对准状态时，扇形工具架轴向移动成与主轴成协作关系，并进行工具传送。 提供了用于将每个扇形工具夹具锁定到非活动轴向存储位置的装置，除非选择。

公开(公告)号：US06661664B2

公开(公告)日：2003-12-09

申请号：US10129114

申请日：2002-05-13

申请人： Claude Sarno ,  Georges Moulin

发明人： Claude Sarno ,  Georges Moulin

IPC分类号： H05K720

CPC分类号： H05K7/20545

摘要： A structure to improve the cooling of electronic modules of the type including a printed circuit board contained between two covers. The structure extracts, by at least one of the covers, heat produced by at least one component borne by the printed circuit board. According to one feature, the cover responsible for extracting the heat bears at least one device having a high thermal conductivity, making it possible to even out the temperatures of the surface of the cover with which it is in contact. Such a structure may be particularly applied to the electronic modules on board aircraft.

摘要翻译： 一种用于改善包括在两个盖之间的印刷电路板的类型的电子模块的冷却的结构。 该结构由至少一个盖板提取由至少一个由印刷电路板承载的部件产生的热量。 根据一个特征，负责提取热量的盖承载至少一个具有高导热性的装置，使得可以使与其接触的盖的表面的温度均匀。 这种结构可以特别地应用于飞机上的电子模块。