公开(公告)号：US20180331051A1

公开(公告)日：2018-11-15

申请号：US15776021

申请日：2015-12-22

Applicant: Georgios C. DOGLAMIS ,  Telesphor KAMGAING ,  Eric J. LI ,  Javier A. FALCON ,  INTEL CORPORATION

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Eric J. LI, Sr. ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR ,  Shawna M. LIFF

IPC: H01L23/66 ,  H01L23/552 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.