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公开(公告)号:US20140299466A1
公开(公告)日:2014-10-09
申请号:US14269836
申请日:2014-05-05
申请人: Prabhat Kumar , Charles Wood , Gary Rozak , Steven A. Miller , Glen Zeman , Rong-Chein Richard Wu
发明人: Prabhat Kumar , Charles Wood , Gary Rozak , Steven A. Miller , Glen Zeman , Rong-Chein Richard Wu
IPC分类号: C23C14/34
CPC分类号: C23C14/3414 , B22F3/1017 , B22F2003/241 , B22F2003/247 , B22F2998/10 , C22C1/045 , B22F3/04 , B22F3/24
摘要: The present invention is directed to a process for producing high density, refractory metal products via a press/sintering process. The invention is also directed to a process for producing a sputtering target and to the sputtering target so produced.
摘要翻译: 本发明涉及一种通过压制/烧结方法生产高密度难熔金属产品的方法。 本发明还涉及一种用于制造溅射靶和如此制造的溅射靶的方法。
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公开(公告)号:US20080171215A1
公开(公告)日:2008-07-17
申请号:US11653816
申请日:2007-01-16
申请人: Prabhat Kumar , Charles Wood , Gary Rozak , Steven A. Miller , Glen Zeman , Rong-Chein Richard Wu
发明人: Prabhat Kumar , Charles Wood , Gary Rozak , Steven A. Miller , Glen Zeman , Rong-Chein Richard Wu
CPC分类号: C23C14/3414 , B22F3/1017 , B22F2003/241 , B22F2003/247 , B22F2998/10 , C22C1/045 , B22F3/04 , B22F3/24
摘要: The present invention is directed to a process for producing high density, refractory metal products via a press/sintering process. The invention is also directed to a process for producing a sputtering target and to the sputtering target so produced.
摘要翻译: 本发明涉及一种通过压制/烧结方法生产高密度难熔金属产品的方法。 本发明还涉及一种用于制造溅射靶和如此制造的溅射靶的方法。
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公开(公告)号:US08784729B2
公开(公告)日:2014-07-22
申请号:US11653816
申请日:2007-01-16
申请人: Prabhat Kumar , Charles Wood , Gary Rozak , Steven A. Miller , Glen Zeman , Rong-Chein Richard Wu
发明人: Prabhat Kumar , Charles Wood , Gary Rozak , Steven A. Miller , Glen Zeman , Rong-Chein Richard Wu
CPC分类号: C23C14/3414 , B22F3/1017 , B22F2003/241 , B22F2003/247 , B22F2998/10 , C22C1/045 , B22F3/04 , B22F3/24
摘要: The present invention is directed to a process for producing high density, refractory metal products via a press/sintering process. The invention is also directed to a process for producing a sputtering target and to the sputtering target so produced.
摘要翻译: 本发明涉及一种通过压制/烧结方法生产高密度难熔金属产品的方法。 本发明还涉及一种用于制造溅射靶和如此制造的溅射靶的方法。
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