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公开(公告)号:US07238881B1
公开(公告)日:2007-07-03
申请号:US11007930
申请日:2004-12-09
申请人: Gordon O. Barr , Ted Choinski , Bruce Gray
发明人: Gordon O. Barr , Ted Choinski , Bruce Gray
IPC分类号: H05K5/00
CPC分类号: H05K13/0486 , H01L24/16 , H01L24/98 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14
摘要: An improved rework nozzle includes an open housing which when lowered onto the surface of a board forms a closed cavity. The housing includes venting means which expend air that is input to the cavity, thereby using flow through concepts to maintain a uniform temperature in the cavity. The housing also positioning mechanisms for both aligning a the housing and a captive integrated circuit to a desired footprint on the circuit board, and for limiting movement of the integrated circuit during rework.
摘要翻译: 改进的返工喷嘴包括敞开的壳体,当下降到板的表面上时形成闭合的腔。 壳体包括排放装置,其排放输入到空腔的空气,从而使用流过概念以保持空腔中的均匀温度。 壳体还具有定位机构,用于将壳体和集成电路对准到电路板上的期望占地面积,并且用于限制返工期间集成电路的移动。
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2.
公开(公告)号:US06503336B1
公开(公告)日:2003-01-07
申请号:US09813697
申请日:2001-03-21
申请人: Gordon O. Barr
发明人: Gordon O. Barr
IPC分类号: B08B300
CPC分类号: H05K13/0465 , B23K1/012 , B23K2101/40 , H01L24/81 , H01L2224/81801 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H05K3/3436 , H05K3/3494 , H01L2924/00
摘要: A nozzle applies fluid (e.g., heated gas) to a solder region of a circuit board component having a set of fluid-delivery edges and a set of fluid-escape edges. The nozzle includes a top member to connect with a fluid source, and a set of fluid-delivery side members coupled to the top member. Each fluid-delivery side member extends from the top member and around a respective fluid-delivery edge of the circuit board component when the circuit board component engages with the nozzle. Each fluid-delivery side member defines (i) at least a portion of a fluid-delivery channel that extends from a vicinity adjacent the top member toward the solder region of the circuit board component when the circuit board component engages with the nozzle, and (ii) a barrier that substantially prevents fluid from escaping from the solder region along the respective fluid-delivery edge for that fluid-delivery side member.
摘要翻译: 喷嘴将流体(例如,加热气体)施加到具有一组流体输送边缘和一组流体逸出边缘的电路板部件的焊接区域。 喷嘴包括与流体源连接的顶部构件和联接到顶部构件的一组流体输送侧构件。 当电路板部件与喷嘴接合时,每个流体输送侧部件从顶部部件延伸并且围绕电路板部件的相应流体输送边缘延伸。 每个流体输送侧构件限定(i)当电路板部件与喷嘴接合时,从邻近顶部构件的附近朝向电路板部件的焊接区域延伸的流体输送通道的至少一部分,和 ii)阻挡物,其基本上防止流体沿着用于该流体输送侧构件的相应流体输送边缘从焊料区域逸出。
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公开(公告)号:US09631842B1
公开(公告)日:2017-04-25
申请号:US13308402
申请日:2011-11-30
IPC分类号: F25B21/00
CPC分类号: F25B21/00 , F25B2321/0021 , F25B2321/0023 , Y02B30/66
摘要: A magneto-caloric cooling system includes an energy absorption area configured to be positioned proximate a thermal energy producing device. At least one energy dissipation area is configured to be positioned proximate a thermal energy dissipation device. A thermal energy transfer device is configured to be cycled between the energy absorption area and the energy dissipation area. A magnetic field generation device is configured to produce a magnetic field proximate the energy dissipation area.
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公开(公告)号:US06525811B1
公开(公告)日:2003-02-25
申请号:US09824077
申请日:2001-04-02
申请人: James J. Paladino , Bruce Gray , Gordon O. Barr
发明人: James J. Paladino , Bruce Gray , Gordon O. Barr
IPC分类号: G01B1114
CPC分类号: G01N21/95684 , Y10T29/49131
摘要: The invention is directed to techniques for inspecting a circuit board having a surface that includes at least one circuit board component. The apparatus includes a base, and a set of reflective members that includes at least one reflective member. Each reflective member of the set of reflective members is (i) supported by the base and (ii) movable relative to the base to enable that reflective member to move to an angle that reflects light from a respective portion of a circuit board component (e.g., a solder region between the component and the circuit board) in a direction away from the surface of the circuit board when the base rests on the surface of the circuit board. Since the base can rest on the surface of the circuit board, a technician does not need to hold the apparatus.
摘要翻译: 本发明涉及用于检查具有包括至少一个电路板部件的表面的电路板的技术。 该装置包括基座和一组包括至少一个反射构件的反射构件。 该组反射构件的每个反射构件(i)由基座支撑并且(ii)可相对于底座移动,以使该反射构件能够移动至反射来自电路板部件的相应部分的光的角度(例如, ,组件和电路板之间的焊料区域),当基座搁置在电路板的表面上时,该方向远离电路板的表面。 由于基座可以搁置在电路板的表面上,所以技术人员不需要固定设备。
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