公开(公告)号：US06361422B1

公开(公告)日：2002-03-26

申请号：US09547189

申请日：2000-04-11

申请人： Gary Ettinger ,  Greg Wiese ,  Arulkumar Shanmugasundrum

发明人： Gary Ettinger ,  Greg Wiese ,  Arulkumar Shanmugasundrum

IPC分类号： B24B4702

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/67313 ,  H01L21/68707

摘要： A semiconductor substrate processing method and apparatus, more specifically, a method and apparatus for polishing a substrate or semiconductor wafer in a polishing system. In one embodiment, the system includes one or more polishing modules, an input module, a first robot and a second robot that provides a compact polishing system that has a minimal tool footprint. The first robot is adapted to transfer the substrate to the input module, while the second robot is adapted to transfer the substrate between the input module and the one or more polishing modules. In another embodiment, the first and second robots have rotary actuators coupled to their grippers that enable the substrate to be orientated between a horizontal and vertical position. The input module is adapted to maintain the substrate in a vertical orientation. The vertical orientation of the substrates facilitates integration of a cleaning system that cleans the substrates while in the vertical orientation.

摘要翻译： 一种半导体衬底处理方法和装置，更具体地说，一种用于在抛光系统中抛光衬底或半导体晶片的方法和装置。 在一个实施例中，系统包括一个或多个抛光模块，输入模块，第一机器人和第二机器人，其提供具有最小工具占地面积的紧凑抛光系统。 第一机器人适于将基板传送到输入模块，而第二机器人适于在输入模块和一个或多个抛光模块之间传送基板。 在另一个实施例中，第一和第二机器人具有联接到它们的夹持器的旋转致动器，其使得基板能够在水平和垂直位置之间定向。 输入模块适于将衬底维持在垂直取向。 衬底的垂直取向促进了在垂直取向时清洁衬底的清洁系统的集成。