公开(公告)号：US06317325B1

公开(公告)日：2001-11-13

申请号：US09510808

申请日：2000-02-23

申请人： Naresh C. Patel ,  Gregory Simeon Sysak

发明人： Naresh C. Patel ,  Gregory Simeon Sysak

IPC分类号： H05H720

CPC分类号： H05K9/0062 ,  H05K7/20445

摘要： An apparatus for dissipating heat generated by components housed within modules on a circuit pack includes a first cover member having a deflectable cantilevered region that is defined by a U-shaped slot. A conductive post is mounted or otherwise formed on the underside of the cantilevered region so that the post extends downwardly into the module when the first cover member is secured to the module housing. The conductive post cooperates with a top surface of a component in the module so that heat generated from the component is transferred from the component through the conductive post and distributed along the first cover member. To further reduce interference caused by electromagnetic radiation passing through the U-shaped slot, a second cover member, which includes an opening that is sized for receiving and passing through the conductive post, is disposed between the module housing and the first cover member. The second cover member covers the U-shaped slot in the first cover member to substantially reduce electromagnetic interference caused by one or more components in the module.

摘要翻译： 一种用于耗散容纳在电路板上的模块内的部件产生的热量的装置包括具有由U形槽限定的可偏转悬臂区域的第一盖构件。 导电柱安装或以其它方式形成在悬臂区域的下侧，使得当第一盖构件固定到模块壳体时，柱向下延伸到模块中。 导电柱与模块中的部件的顶表面配合，使得从部件产生的热量从部件通过导电柱转移并沿着第一盖构件分布。 为了进一步减少由穿过U形槽的电磁辐射引起的干扰，包括尺寸适于接收和穿过导电柱的开口的第二盖构件设置在模块壳体和第一盖构件之间。 第二盖构件覆盖第一盖构件中的U形槽，以大大减少由模块中的一个或多个构件引起的电磁干扰。