公开(公告)号：US12127361B2

公开(公告)日：2024-10-22

申请号：US17577393

申请日：2022-01-18

Applicant: MONTAGE ELECTRONICS (SHANGHAI) CO., LTD.

Inventor： Christopher Cox ,  Leechung Yiu ,  Robert Xi Jin ,  Zheng Qiu ,  Leonard Datus ,  Lizhi Jin

IPC: G11C5/04 ,  H05K5/00 ,  H05K5/02 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K5/026 ,  G11C5/04 ,  H05K5/0026 ,  H05K7/1427 ,  H05K7/20445

Abstract: The present application provides a memory device. The memory device includes a connector plate having a front edge and a rear edge opposite to the front edge, wherein the connector plate comprises an edge connector disposed at the rear edge and configured to connect to a host connector of a host device; a controller plate defining a first connection region, a second connection region and a chip region, wherein the controller plate is attached to the connector plate at the first connection region, and the controller plate comprises a memory control module disposed in the chip region and in electrical communication with the edge connector; and at least one memory module detachably connected to the controller plate at the second connection region of the controller plate, wherein each of the at least one memory module is in electrical communication with the memory control module when the memory module is connected to the controller plate, such that the memory module can be accessible by the host device via the memory control module.

公开(公告)号：US12127328B2

公开(公告)日：2024-10-22

申请号：US17747810

申请日：2022-05-18

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yang Liu ,  Feng Liu ,  Biao Hu ,  Yuxiu Liu

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02

CPC classification number: H05K1/0203 ,  H05K1/181 ,  H05K5/0247 ,  H05K7/20145 ,  H05K7/2039 ,  H05K7/20445

Abstract: This application relates to the field of electronic device technologies, and provides an electronic component with an enclosure frame, a circuit board with an electronic component, and an electronic device, to effectively protect the circuit board from being corroded, thereby prolonging a service life of the electronic device. This application is applied to a charging pile for charging a new energy electric vehicle. An electronic component with an enclosure frame includes an enclosure frame and an electronic component. The enclosure frame defines a cavity that is closed or that has one open end; when the electronic component with an enclosure frame is connected to a circuit board, the enclosure frame and the circuit board can define a cavity that is closed or that has one open end.

公开(公告)号：US12075600B1

公开(公告)日：2024-08-27

申请号：US17861139

申请日：2022-07-08

Applicant: Anthony Lane Snyder

Inventor： Anthony Lane Snyder

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20418 ,  G06F1/20 ,  H05K7/20436 ,  H05K7/20445 ,  H05K7/20509

Abstract: A fanless computer case assembly is configured to distribute heat from a computer through a thermal accessory. The fanless computer case assembly includes a fanless computer case that has a bottom cover joined to a front panel and a rear panel. A top cover is joined to the front panel and the rear panel. A mother board includes a central processing unit is arranged between the front panel and the rear panel. An upper CPU mounting plate and a lower CPU mounting plate are joined to the central processing unit. A base plate is attached to the upper CPU mounting plate and the top cover with a spacer creating an air gap between the base plate and the top cover. A first heat transfer plate is attached to the lower CPU mounting plate and the bottom cover.

公开(公告)号：US20240260203A1

公开(公告)日：2024-08-01

申请号：US18564297

申请日：2022-06-07

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Issei HORIBA ,  Yuki FUJIMURA ,  Masato TSUTSUKI

IPC: H05K5/00 ,  B60R16/023 ,  H02G3/16 ,  H05K7/20

CPC classification number: H05K5/0026 ,  H05K5/0047 ,  H05K7/20445 ,  B60R16/0238 ,  H02G3/16

Abstract: An electrical junction box includes a circuit board, a branch circuit assembly for distributing power to various devices, a housing that accommodates the circuit board and the branch circuit assembly, and a board-side connector module in which a plurality of board-side connectors mounted on the circuit board are formed as a single body. The branch circuit assembly includes an internal circuit including busbars and an electrical component, a case that accommodates the internal circuit, and a plurality of relay connectors that protrude from the case, are electrically connected to the internal circuit, and are respectively connected to the plurality of board-side connectors, and the board-side connectors are connected to the corresponding relay connectors in a state in which the branch circuit assembly and the circuit board are assembled to the housing.

公开(公告)号：US20240243114A1

公开(公告)日：2024-07-18

申请号：US18414485

申请日：2024-01-17

Applicant: Acer Incorporated

Inventor： Yu-Ming Lin ,  Mao-Neng Liao ,  Cheng-Wen Hsieh ,  Kuang-Hua Lin ,  Wei-Chin Chen ,  Kuan-Lin Chen ,  Chun-Chieh Wang

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/24 ,  H05K7/20

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H05K7/20445 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33183 ,  H01L2924/0665 ,  H01L2924/1432

Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.

公开(公告)号：US20240208340A1

公开(公告)日：2024-06-27

申请号：US18389902

申请日：2023-12-20

Applicant: Yazaki Corporation

Inventor： Akihiro SAITO ,  Shinsuke AOSHIMA

IPC: B60L53/16 ,  H05K7/20

CPC classification number: B60L53/16 ,  H05K7/20445

Abstract: A charge inlet that can alleviate temperature rise during charging while alleviating the increase in the weight and cost around the inlet and the increase in the size of the inlet is provided. The charge inlet 100 includes a connector terminal 110, a housing 120 in which the connector terminal 110 is inserted in a predetermined insertion direction D11, and a heat-drawing component 130 detachably accommodated in the housing 120 in such a state that the heat-drawing component 130 is in contact, in a contact direction D12 that crosses the insertion direction D11, with an electric wire connection portion 112 (heat source) of the connector terminal 110 that is away, in a direction opposite to the insertion direction D11, from a terminal portion of 111 the connector terminal 110 for connecting with a mating connector terminal, or with an electric wire terminal W111 (intermediate member) that is in contact with the electric wire connection portion 112 (the heat source), the heat-drawing component 130 being configured to absorb heat of the electric wire connection portion 112 of the connector terminal 110 (the heat source).

公开(公告)号：US11980010B2

公开(公告)日：2024-05-07

申请号：US17889727

申请日：2022-08-17

Applicant: Google LLC

Inventor： Frédéric Heckmann ,  Ihab A. Ali

IPC: H05K7/20 ,  H01L23/373 ,  H05K9/00

CPC classification number: H05K7/2039 ,  H01L23/3735 ,  H05K7/20472 ,  H05K9/0033 ,  H05K9/006 ,  H05K7/20445

Abstract: This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

公开(公告)号：US11925002B2

公开(公告)日：2024-03-05

申请号：US17176283

申请日：2021-02-16

Applicant: AMLI MATERIALS TECHNOLOGY CO., LTD.

Inventor： Jian-Jia Huang ,  Chun-Kai Lin ,  Chih-Ching Chen

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20445 ,  G06F1/203 ,  H05K7/20509

Abstract: A casing structure with functionality of effective thermal management is disclosed, which consists of a casing member, a low thermal conductivity medium, a second heat spreader, and a first heat spreader. When a user operates the electronic device, heat generated from CPU and/or GPU is transferred to the second heat spreader via the first heat spreader, and then is two-dimensionally spread in the second heat spreader. Consequently, the heat is dissipated away from the casing member to air due to the outstanding thermal radiation ability of the casing member. The low thermal conductivity medium is adopted for controlling a heat transfer of heat transferring paths from the heat source and ends to the casing member. By applying the casing structure in an electronic device by a form of a top casing and/or a back casing, an outer surface temperature of the casing member can be well controlled.

公开(公告)号：US11848705B2

公开(公告)日：2023-12-19

申请号：US17361301

申请日：2021-06-28

Applicant: Prime World International Holdings Ltd.

Inventor： Ling-An Kung ,  Hsuan-Chen Shiu ,  Guang-Kai Wu

IPC: H04B10/40 ,  G02B6/42 ,  H05K7/20

CPC classification number: H04B10/40 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/4277 ,  H05K7/20445

Abstract: An optical transceiver includes a housing, a heat source accommodated in the housing, and a heat spreader. The heat spreader includes a heat transfer portion accommodated in the housing and a heat dissipation portion exposed to outside. The heat spreader is in thermal contact with the heat source, and the heat dissipation portion of the heat spreader is in proximity of an optical port of the housing.

公开(公告)号：US11839058B2

公开(公告)日：2023-12-05

申请号：US16785583

申请日：2020-02-08

Applicant: David Lane Smith

Inventor： David Lane Smith

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H05K5/02

CPC classification number: H05K7/20445 ,  H05K5/0217

Abstract: A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.