摘要:
Flow paths, duct work, ventilation boundaries, and/or placement of EHD and mechanical air mover within a electronic device enclosure can all affect the efficacy of a thermal management solution that seeks to provide silent air cooling over a significant thermal operating envelope with staged introduction of electrohydrodynamic (EHD) and mechanical air mover devices. For electronic devices in which it is desirable to employ passive, unforced convective cooling over a portion of the thermal operating envelope, practical designs for consumer electronics form factors may be quite sensitive to flow path, duct work and ventilation boundary design as well as to the placement of EHD and mechanical air mover components relative thereto and to each other. A range of inventive solutions that have been developed to address some or all of these design challenges.
摘要:
Techniques are described for integration of EHD-type air movers with electronic systems, and in particular, for limiting infiltration of ions and/or charged particulates into an internal air plenum. In some designs, it may be desirable to allow or even encourage EHD motivated air flow (whether drawn or forced) through the internal air plenum while providing a barrier to transit of ions and/or charged particulates that may be generated during EHD operation. Such a barrier may employ electrostatic forces to impede transit of ions and/or charged particulate across a vent positioned to allow air flow from or into the internal air plenum. In some cases, an electrostatic barrier may include a fluid permeable mesh or grill that spans a substantial cross-section of the vent.