SINGLE CRYSTAL FILM BULK ACOUSTIC WAVE RESONATOR, AND PREPARATION METHOD AND APPLICATION THEREOF

    公开(公告)号:US20240305268A1

    公开(公告)日:2024-09-12

    申请号:US18271311

    申请日:2022-12-20

    Inventor: Guoqiang Li

    CPC classification number: H03H9/175 H03H3/02 H03H9/176 H03H2003/025

    Abstract: A single crystal film bulk acoustic wave resonator includes a substrate layer, a Bragg reflection layer, a first bonding layer, a second bonding layer, a piezoelectric layer and an electrode layer; a width of the electrode layer is smaller than that of the piezoelectric layer. The resonator further includes a first silicon oxide layer and a second silicon oxide layer, which surround the first bonding layer and the second bonding layer respectively, and a plurality of first air holes horizontally arranged and a plurality of second air holes horizontally arranged are respectively formed in the first silicon oxide layer and the second silicon oxide layer. Each of the plurality of first air holes corresponds to and is communicated with a respective one of the plurality of second air holes. The piezoelectric layer is made of AlN or lithium niobate.

    BULK ACOUSTIC WAVE RESONATOR CAPABLE OF IMPROVING POWER CAPACITY AND PREPARATION METHOD THEREOF

    公开(公告)号:US20240305267A1

    公开(公告)日:2024-09-12

    申请号:US18271325

    申请日:2022-12-20

    Inventor: Guoqiang Li

    CPC classification number: H03H9/173 H03H3/02 H03H9/176 H03H2003/021

    Abstract: A bulk acoustic wave resonator capable of improving a power capacity includes a substrate, a first diamond film layer, a piezoelectric layer and a second diamond film layer; a first cavity is formed in the first diamond film layer; a bottom electrode is arranged on the first diamond film layer and located in the piezoelectric layer; a second cavity is formed in the second diamond film layer, and a top electrode is arranged in the second cavity on the piezoelectric layer; a first through hole is formed between the top electrode and the bottom electrode, and the first through hole penetrates through the top electrode and the bottom electrode, and communicates with the first cavity and the second cavity; and a second through hole is further formed in the second diamond film layer, and the second through hole communicates with the second cavity and the outside.

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