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公开(公告)号：US20210320590A1
公开(公告)日：2021-10-14
申请号：US16844104
申请日：2020-04-09
摘要： A re-configurable bank of DC-DC converters has many channels, each with a DC-DC converter and a controller that senses the channel's output voltage and current to adjust a duty cycle of switch signals to the DC-DC converter. A serial bus connects to all controllers and writes digital voltage and current control targets into each controller. The controller has Digital-to-Analog Converters (DACs) that convert the targets to analog voltages that are compared to sensed output voltage and current. The comparison results are compared to a sawtooth wave to generate pulses of the switch signals that have a duty cycle adjusted for the target comparisons. In combined mode, a primary channel's controller generates switch signals for secondary channels having outputs shorted to the primary channel. Secondary channels have a mux to select switch signals from the primary controller during combined mode, and from the secondary controller during separated mode.
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公开(公告)号：US11258364B2
公开(公告)日：2022-02-22
申请号：US16844104
申请日：2020-04-09
摘要： A re-configurable bank of DC-DC converters has many channels, each with a DC-DC converter and a controller that senses the channel's output voltage and current to adjust a duty cycle of switch signals to the DC-DC converter. A serial bus connects to all controllers and writes digital voltage and current control targets into each controller. The controller has Digital-to-Analog Converters (DACs) that convert the targets to analog voltages that are compared to sensed output voltage and current. The comparison results are compared to a sawtooth wave to generate pulses of the switch signals that have a duty cycle adjusted for the target comparisons. In combined mode, a primary channel's controller generates switch signals for secondary channels having outputs shorted to the primary channel. Secondary channels have a mux to select switch signals from the primary controller during combined mode, and from the secondary controller during separated mode.
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公开(公告)号：US11206014B1
公开(公告)日：2021-12-21
申请号：US17241287
申请日：2021-04-27
发明人： Chik Wai (David) Ng , Wai Kit (Victor) So , Yuanzhe (Kevin) Xu , Ka Lok (Roy) Ng , Tin Ho (Andy) Wu
摘要： A modulator spreads the spectrum of a generated clock to reduce Electro-Magnetic Interference (EMI). A capacitor is charged by a variable current to generate a ramp voltage that is compared to a reference to end a clock cycle and discharge the capacitor. An up-down counter drives a Digital-to-Analog Converter (DAC) that controls the variable charging current to provide triangle modulation. A smaller offset current is added or subtracted for cubic modulation when the up-down counter reaches its minimum count. A frequency divider that clocks the up-down counter also clocks a Linear-Feedback Shift-Register (LFSR) to that controls pseudo-random current sources that further modulate variable current and frequency. The LFSR is clocked with the up-down counter to modulate each frequency step, or only at the minimum count to randomly modulate at the minimum frequency. Binary-weighted bits from the up-down counter to the DAC are swapped to modulate the frequency step size.
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公开(公告)号：US11990422B2
公开(公告)日：2024-05-21
申请号：US17693566
申请日：2022-03-14
发明人： Chik Wai (David) Ng , Kwun Yuan (Godwin) Ho , Ki Hin (Gary) Choi , Tin Ho (Andy) Wu , Wai Kit (Victor) So
IPC分类号： H01L23/64 , H01L23/00 , H01L23/498 , H01L23/552
CPC分类号： H01L23/552 , H01L23/49861 , H01L23/645 , H01L24/16 , H01L24/48 , H01L2224/16221 , H01L2224/48249 , H01L2224/48257 , H01L2924/182 , H01L2924/3025
摘要： An Integrated Circuit (IC) package has a ferrite-dielectric shield between a planar inductor coil and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in the inductor coil from reaching the semiconductor chip. The shield has a ferrite layer surrounded by upper and lower dielectric laminate layers to prevent electrical shorts. The center end of the inductor coil connects to the semiconductor chip through a center post that fits through an opening in the shield that is over the air core center of the inductor coil. The center post can connect to a die attach pad that the semiconductor chip is mounted to. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors. The outer end of the inductor coil connects to lead-frame outer risers also having external package connectors such as pins or bonding balls.
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5.发明公开公开(公告)号：US20230290736A1
公开(公告)日：2023-09-14
申请号：US17693576
申请日：2022-03-14
发明人： Chik Wai (David) NG , Kwun Yuan (Godwin) HO , Ki Hin (Gary) CHOI , Tin Ho (Andy) WU , Wai Kit (Victor) SO
IPC分类号： H01L23/552 , H01L23/00 , H01L23/498 , H01L23/64
CPC分类号： H01L23/552 , H01L24/48 , H01L23/49861 , H01L23/645 , H01L24/16 , H01L2224/48249 , H01L2224/48257 , H01L2224/16221 , H01L2924/182 , H01L2924/3025
摘要： An Integrated Circuit (IC) package has a ferrite-dielectric shield between planar transformer coils and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in transformer coils from reaching the semiconductor chip. Multiple layers of planar transformer coils serve as primary or secondary coils and can be connected together in series or parallel using center posts and coil extensions from outer coil windings to lead-frame risers that also have external package connectors such as pins or bonding balls. The center winding of an upper transformer coil connects to the semiconductor chip on a die attach pad through a center post that fits through an opening in the shield that is over the air core center of the transformer coil. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors.
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公开(公告)号：US20230290735A1
公开(公告)日：2023-09-14
申请号：US17693566
申请日：2022-03-14
发明人： Chik Wai (David) NG , Kwun Yuan (Godwin) HO , Ki Hin (Gary) CHOI , Tin Ho (Andy) WU , Wai Kit (Victor) SO
IPC分类号： H01L23/552 , H01L23/00 , H01L23/498 , H01L23/64
CPC分类号： H01L23/552 , H01L24/48 , H01L23/49861 , H01L23/645 , H01L24/16 , H01L2224/48249 , H01L2224/48257 , H01L2224/16221 , H01L2924/182 , H01L2924/3025
摘要： An Integrated Circuit (IC) package has a ferrite-dielectric shield between a planar inductor coil and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in the inductor coil from reaching the semiconductor chip. The shield has a ferrite layer surrounded by upper and lower dielectric laminate layers to prevent electrical shorts. The center end of the inductor coil connects to the semiconductor chip through a center post that fits through an opening in the shield that is over the air core center of the inductor coil. The center post can connect to a die attach pad that the semiconductor chip is mounted to. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors. The outer end of the inductor coil connects to lead-frame outer risers also having external package connectors such as pins or bonding balls.
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