公开(公告)号：US08114700B2

公开(公告)日：2012-02-14

申请号：US12917916

申请日：2010-11-02

申请人： Yoshiyuki Miyashita ,  Kazumoto Doi ,  Tadao Imai ,  Hiroaki Iwaseki

发明人： Yoshiyuki Miyashita ,  Kazumoto Doi ,  Tadao Imai ,  Hiroaki Iwaseki

IPC分类号： H01L21/00 ,  H04R31/00

CPC分类号： H04R19/005 ,  Y10T29/49005

摘要： In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

摘要翻译： 在本发明中，形成有多个MEMS麦克风的半导体基板被布置成与被放置在片材上的状态相对的放电电极。 设置在MEMS麦克风中的电介质膜的电化是通过在固定电极和设置在MEMS麦克风中的振动膜之间的电介质膜上照射由放电电极的电晕放电产生的离子在预定电位差为 施加到固定电极和振动膜以及基于离子的固定电荷到电介质膜。 通过相对移动半导体衬底和放电电极，连续地对半导体衬底上的每个MEMS麦克风执行电化学处理。 因此，使用低成本且简单的制造设备实现MEMS麦克风芯片中的电介质膜的电化，并且可以提高生产率。

公开(公告)号：US20110045616A1

公开(公告)日：2011-02-24

申请号：US12917916

申请日：2010-11-02

申请人： Yoshiyuki MIYASHITA ,  Kazumoto Doi ,  Tadao Imai ,  Hiroaki Iwaseki

发明人： Yoshiyuki MIYASHITA ,  Kazumoto Doi ,  Tadao Imai ,  Hiroaki Iwaseki

IPC分类号： H01L21/66

CPC分类号： H04R19/005 ,  Y10T29/49005

摘要： In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

摘要翻译： 在本发明中，形成有多个MEMS麦克风的半导体基板被布置成与被放置在片材上的状态相对的放电电极。 设置在MEMS麦克风中的电介质膜的电化是通过在固定电极和设置在MEMS麦克风中的振动膜之间的电介质膜上照射由放电电极的电晕放电产生的离子在预定电位差为 施加到固定电极和振动膜以及基于离子的固定电荷到电介质膜。 通过相对移动半导体衬底和放电电极，连续地对半导体衬底上的每个MEMS麦克风执行电化学处理。 因此，使用低成本且简单的制造设备实现MEMS麦克风芯片中的电介质膜的电化，并且可以提高生产率。

公开(公告)号：US07855095B2

公开(公告)日：2010-12-21

申请号：US12265431

申请日：2008-11-05

申请人： Yoshiyuki Miyashita ,  Kazumoto Doi ,  Tadao Imai ,  Hiroaki Iwaseki

发明人： Yoshiyuki Miyashita ,  Kazumoto Doi ,  Tadao Imai ,  Hiroaki Iwaseki

IPC分类号： H01L21/00 ,  H04R31/00

CPC分类号： H04R19/005 ,  Y10T29/49005

摘要： In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

摘要翻译： 在本发明中，形成有多个MEMS麦克风的半导体基板被布置成与被放置在片材上的状态相对的放电电极。 设置在MEMS麦克风中的电介质膜的电化是通过在固定电极和设置在MEMS麦克风中的振动膜之间的电介质膜上照射由放电电极的电晕放电产生的离子在预定电位差为 施加到固定电极和振动膜以及基于离子的固定电荷到电介质膜。 通过相对移动半导体衬底和放电电极，连续地对半导体衬底上的每个MEMS麦克风执行电化学处理。 因此，使用低成本且简单的制造设备实现MEMS麦克风芯片中的电介质膜的电化，并且可以提高生产率。

公开(公告)号：US20090130783A1

公开(公告)日：2009-05-21

申请号：US12265431

申请日：2008-11-05

申请人： Yoshiyuki MIYASHITA ,  Kazumoto DOI ,  Tadao IMAI ,  Hiroaki IWASEKI

发明人： Yoshiyuki MIYASHITA ,  Kazumoto DOI ,  Tadao IMAI ,  Hiroaki IWASEKI

IPC分类号： H01L21/66 ,  H01L21/50

CPC分类号： H04R19/005 ,  Y10T29/49005

摘要： In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.

摘要翻译： 在本发明中，形成有多个MEMS麦克风的半导体基板被布置成与被放置在片材上的状态相对的放电电极。 设置在MEMS麦克风中的电介质膜的电化是通过在固定电极和设置在MEMS麦克风中的振动膜之间的电介质膜上照射由放电电极的电晕放电产生的离子在预定电位差为 施加到固定电极和振动膜以及基于离子的固定电荷到电介质膜。 通过相对移动半导体衬底和放电电极，连续地对半导体衬底上的每个MEMS麦克风执行电化学处理。 因此，使用低成本且简单的制造设备实现MEMS麦克风芯片中的电介质膜的电化，并且可以提高生产率。