Semiconductor Laser Device and Manufacturing Method Thereof
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    发明申请
    Semiconductor Laser Device and Manufacturing Method Thereof 失效
    半导体激光器件及其制造方法

    公开(公告)号:US20070280318A1

    公开(公告)日:2007-12-06

    申请号:US11665286

    申请日:2005-12-06

    IPC分类号: H01S5/00 H01L21/00

    摘要: A semiconductor laser device (1) includes: a substrate (3) having a principal plane (3a); a photonic crystal layer (7) having an epitaxial layer (2a) of gallium nitride formed on substrate (3) in a direction in which principal plane (3a) extends and a low refractive index material (2b) having a refractive index lower than that of epitaxial layer (2a); an n-type clad layer (4) formed on substrate (3); a p-type clad layer (6) formed on substrate (3); an active layer (5) that is interposed between n-type clad layer (4) and p-type clad layer (6) and emits light when a carrier is injected thereinto; and a GaN layer (12) that covers a region directly on photonic crystal layer (7). Thus, the semiconductor laser device can be manufactured without fusion.

    摘要翻译: 半导体激光装置(1)包括:具有主平面(3a)的基板(3); 具有在主平面(3a)延伸的方向上形成在衬底(3)上的氮化镓的外延层(2a)和具有折射率的低折射率材料(2b)的光子晶体层(7) 低于外延层(2a); 形成在基板(3)上的n型覆盖层(4); 形成在基板(3)上的p型覆盖层(6); 介于n型覆盖层(4)和p型覆盖层(6)之间的有源层(5),并且在载体被注入时发射光; 以及覆盖直接在光子晶体层(7)上的区域的GaN层(12)。 因此,可以不融合地制造半导体激光装置。