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    Mechanical interface apparatus
    1.
    发明授权
    Mechanical interface apparatus 失效
    机械接口装置

    公开(公告)号：US06152669A

    公开(公告)日：2000-11-28

    申请号：US747113

    申请日：1996-11-08

    申请人： Teruya Morita ,  Masanao Murata ,  Hitoshi Kawano ,  Tsuyoshi Tanaka ,  Hiroyuki Oyobe ,  Toshiyuki Takaoka

    发明人： Teruya Morita ,  Masanao Murata ,  Hitoshi Kawano ,  Tsuyoshi Tanaka ,  Hiroyuki Oyobe ,  Toshiyuki Takaoka

    IPC分类号： B65D85/86 ,  H01L21/673 ,  H01L21/677 ,  B65G49/07

    CPC分类号： H01L21/67775 ,  H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

    摘要： A mechanical interface apparatus which is capable of loading semiconductor wafers stored in a sealed container into a processing apparatus without adversely affecting the surfaces of the semiconductor wafers due to exposure to external air or dust. When a sealed container 100 is placed on top of a processing apparatus 200, latch mechanisms 201 are activated to engage with a flange 103, so as to affix the container body 101. Then, valves 3 and 5 are opened to perform a gas purge, after which a drive mechanism provided inside a lock operating mechanism 220 is operated in order to withdraw lock arms 111 from concave portions 103a, thereby unlocking the bottom lid 110. Then, wafer cassettes 106 inside the container are lowered to a predetermined position by means of an in-apparatus elevator mechanism 202, and the wafer cassettes are loaded into the processing apparatus 200 by a cassette loading mechanism.

    摘要翻译： 一种机械接口装置，其能够将存储在密封容器中的半导体晶片装载到处理设备中，而不会由于暴露于外部空气或灰尘而不利地影响半导体晶片的表面。 当将密封容器100放置在处理装置200的顶部时，闩锁机构201被启动以与凸缘103接合，以便固定容器主体101.然后，打开阀3和5以进行气体吹扫， 之后，设置在锁定操作机构220内部的驱动机构，以将锁定臂111从凹部103a中撤出，从而解锁底盖110.然后，容器内部的晶片盒106通过 装置内电梯机构202，并且晶片盒通过盒装载机构装载到处理装置200中。

    Load port
    3.
    发明授权
    Load port 有权
    加载端口

    公开(公告)号：US06186723B1

    公开(公告)日：2001-02-13

    申请号：US09282703

    申请日：1999-03-31

    申请人： Masanao Murata ,  Hiroyuki Oyobe ,  Tsuyoshi Tanaka ,  Zenta Nanpei ,  Toshiyuki Takaoka ,  Hiroaki Saeki ,  Keiichi Matsushima

    发明人： Masanao Murata ,  Hiroyuki Oyobe ,  Tsuyoshi Tanaka ,  Zenta Nanpei ,  Toshiyuki Takaoka ,  Hiroaki Saeki ,  Keiichi Matsushima

    IPC分类号： B65G4907

    CPC分类号： H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

    摘要： A load port for semiconductor equipment includes a transporting apparatus 18 and/or a moving apparatus 30 for respectively transporting a carrier base 14 and moving a cover 15, using a smaller force until the carrier base 14 and/or the cover 15 reaches a predetermined position that is at a predetermined distance from an opening 16 of the equipment. This position is at a distance where it is no longer possible to catch a hand or other object between the carrier base 14 or cover 15 and the semiconductor equipment. Then, the carrier base 14 and/or the cover 15 is transported or moved towards the opening 16 by the transporting apparatus 18 and/or moving apparatus 30 respectively transporting the carrier base 14 and/or moving the cover 15 towards the opening 16 to completely close the opening 16 using a larger force.

    摘要翻译： 用于半导体设备的装载端口包括用于分别运输托架底座14和移动盖子15的运送装置18和/或运动装置30，使用较小的力直到载体基座14和/或盖15到达预定位置 其距离设备的开口16为预定的距离。 该位置处于不可能在载体基座14或盖15与半导体设备之间抓住手或其它物体的距离。 然后，通过运送装置18和/或分别运送托架底座14和/或使盖子15向开口16移动的运动装置30将托架基座14和/或盖15运送或移向开口16 用较大的力量关闭开口16。