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    Mechanical interface apparatus
    1.
    发明授权
    Mechanical interface apparatus 失效
    机械接口装置

    公开(公告)号：US06152669A

    公开(公告)日：2000-11-28

    申请号：US747113

    申请日：1996-11-08

    申请人： Teruya Morita ,  Masanao Murata ,  Hitoshi Kawano ,  Tsuyoshi Tanaka ,  Hiroyuki Oyobe ,  Toshiyuki Takaoka

    发明人： Teruya Morita ,  Masanao Murata ,  Hitoshi Kawano ,  Tsuyoshi Tanaka ,  Hiroyuki Oyobe ,  Toshiyuki Takaoka

    IPC分类号： B65D85/86 ,  H01L21/673 ,  H01L21/677 ,  B65G49/07

    CPC分类号： H01L21/67775 ,  H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

    摘要： A mechanical interface apparatus which is capable of loading semiconductor wafers stored in a sealed container into a processing apparatus without adversely affecting the surfaces of the semiconductor wafers due to exposure to external air or dust. When a sealed container 100 is placed on top of a processing apparatus 200, latch mechanisms 201 are activated to engage with a flange 103, so as to affix the container body 101. Then, valves 3 and 5 are opened to perform a gas purge, after which a drive mechanism provided inside a lock operating mechanism 220 is operated in order to withdraw lock arms 111 from concave portions 103a, thereby unlocking the bottom lid 110. Then, wafer cassettes 106 inside the container are lowered to a predetermined position by means of an in-apparatus elevator mechanism 202, and the wafer cassettes are loaded into the processing apparatus 200 by a cassette loading mechanism.

    摘要翻译： 一种机械接口装置，其能够将存储在密封容器中的半导体晶片装载到处理设备中，而不会由于暴露于外部空气或灰尘而不利地影响半导体晶片的表面。 当将密封容器100放置在处理装置200的顶部时，闩锁机构201被启动以与凸缘103接合，以便固定容器主体101.然后，打开阀3和5以进行气体吹扫， 之后，设置在锁定操作机构220内部的驱动机构，以将锁定臂111从凹部103a中撤出，从而解锁底盖110.然后，容器内部的晶片盒106通过 装置内电梯机构202，并且晶片盒通过盒装载机构装载到处理装置200中。

    Wafer airtight keeping unit and keeping facility thereof
    4.
    发明授权
    Wafer airtight keeping unit and keeping facility thereof 失效
    晶圆密封单元及其保持设备

    公开(公告)号：US5303482A

    公开(公告)日：1994-04-19

    申请号：US826954

    申请日：1992-01-28

    申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi ,  Hiromi Morita

    发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi ,  Hiromi Morita

    IPC分类号： H01L21/677 ,  F26B21/06

    CPC分类号： H01L21/67769 ,  Y10S414/14

    摘要： A wafer keeping apparatus includes a closed wafer keeping space, and an arrangement for circulating an inert gas through a filter and then through the wafer keeping space. In one embodiment, several wafer keeping shelves are each provided within the space, and the inert gas is supplied through a respective filter to flow across each shelf. In another embodiment, a plurality of wafer keeping spaces are each accessible through a respective door which forms an airtight seal when it is closed, and respective filters are provided on opposite sides of the space, the inert gas being supplied to the space through one filter and exiting the space through the other filter. In a further embodiment, several of the wafer keeping spaces are provided at angularly and vertically spaced locations in a rotatable stocker body provided within a casing, and several vertically spaced doors are provided on the casing to provide access to respective wafer keeping spaces in the stocker body.

    摘要翻译： 晶片保存装置包括封闭的晶片保持空间，以及用于使惰性气体通过过滤器然后通过晶片保持空间循环的装置。 在一个实施例中，在该空间内分别提供几个晶片保持架，并且惰性气体通过相应的过滤器供应流过每个搁架。 在另一个实施例中，多个晶片保持空间各自可通过相应的门接近，门在关闭时形成气密密封，并且各个过滤器设置在空间的相对侧上，惰性气体通过一个过滤器 并通过另一个过滤器离开空间。 在另一个实施例中，几个晶片保持空间设置在设置在壳体内的可转动的储带架主体中的角度和垂直间隔的位置处，并且几个垂直间隔的门设置在壳体上以提供对存储器中的相应晶片保持空间的访问 身体。

    Electronic substrate processing system using portable closed containers
    5.
    发明授权
    Electronic substrate processing system using portable closed containers 失效
    电子基板处理系统采用便携式密闭容器

    公开(公告)号：US5746008A

    公开(公告)日：1998-05-05

    申请号：US803818

    申请日：1997-02-24

    申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

    发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Mitsuhiro Hayashi ,  Atsushi Okuno ,  Akio Nakamura

    IPC分类号： H01L21/00 ,  H01L21/677 ,  G26B19/00

    CPC分类号： H01L21/67757 ,  H01L21/67057 ,  H01L21/67769 ,  H01L21/67772

    摘要： Disclosed is an electronic substrate processing system comprising a processing equipment for processing electronic substrates including semiconductor wafers and liquid crystal substrates; a cleaning equipment for cleaning said electronic substrate in a predetermined processing step; a portable closed container for accommodating a cassette containing said electronic substrate; a purging station for gas-purging said portable closed containers; and a storage member for storing said portable closed containers, wherein said cassette accommodates said electronic substrates which have been cleaned by said cleaning equipment being set in said portable closed container and purged with an inert gas in said purging station, and said portable closed container or containers is stored in said storing section when necessary.

    摘要翻译： 公开了一种电子基板处理系统，包括用于处理包括半导体晶片和液晶基板的电子基板的处理设备; 用于在预定处理步骤中清洁所述电子基板的清洁设备; 用于容纳包含所述电子基板的盒的便携式密闭容器; 用于吹扫所述便携式密闭容器的清洗站; 以及用于存储所述便携式封闭容器的存储构件，其中所述盒容纳已经被所述清洁设备清洁的所述电子基板设置在所述便携式密闭容器中并在所述清洗站中用惰性气体吹扫，并且所述便携式密闭容器或 必要时将容器储存在所述储存部分中。

    Load port
    8.
    发明授权
    Load port 有权
    加载端口

    公开(公告)号：US06186723B1

    公开(公告)日：2001-02-13

    申请号：US09282703

    申请日：1999-03-31

    申请人： Masanao Murata ,  Hiroyuki Oyobe ,  Tsuyoshi Tanaka ,  Zenta Nanpei ,  Toshiyuki Takaoka ,  Hiroaki Saeki ,  Keiichi Matsushima

    发明人： Masanao Murata ,  Hiroyuki Oyobe ,  Tsuyoshi Tanaka ,  Zenta Nanpei ,  Toshiyuki Takaoka ,  Hiroaki Saeki ,  Keiichi Matsushima

    IPC分类号： B65G4907

    CPC分类号： H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

    摘要： A load port for semiconductor equipment includes a transporting apparatus 18 and/or a moving apparatus 30 for respectively transporting a carrier base 14 and moving a cover 15, using a smaller force until the carrier base 14 and/or the cover 15 reaches a predetermined position that is at a predetermined distance from an opening 16 of the equipment. This position is at a distance where it is no longer possible to catch a hand or other object between the carrier base 14 or cover 15 and the semiconductor equipment. Then, the carrier base 14 and/or the cover 15 is transported or moved towards the opening 16 by the transporting apparatus 18 and/or moving apparatus 30 respectively transporting the carrier base 14 and/or moving the cover 15 towards the opening 16 to completely close the opening 16 using a larger force.

    摘要翻译： 用于半导体设备的装载端口包括用于分别运输托架底座14和移动盖子15的运送装置18和/或运动装置30，使用较小的力直到载体基座14和/或盖15到达预定位置 其距离设备的开口16为预定的距离。 该位置处于不可能在载体基座14或盖15与半导体设备之间抓住手或其它物体的距离。 然后，通过运送装置18和/或分别运送托架底座14和/或使盖子15向开口16移动的运动装置30将托架基座14和/或盖15运送或移向开口16 用较大的力量关闭开口16。

    ID recognizing system in semiconductor manufacturing system
    10.
    发明授权
    ID recognizing system in semiconductor manufacturing system 失效
    半导体制造系统中的识别识别系统

    公开(公告)号：US5389769A

    公开(公告)日：1995-02-14

    申请号：US037976

    申请日：1993-03-26

    申请人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi

    发明人： Teppei Yamashita ,  Masanao Murata ,  Tsuyoshi Tanaka ,  Teruya Morita ,  Hitoshi Kawano ,  Atsushi Okuno ,  Masanori Tsuda ,  Mitsuhiro Hayashi

    IPC分类号： G06K17/00 ,  G06K19/10 ,  H01L21/02 ,  G06F15/46

    CPC分类号： G06K17/00 ,  G06K2017/0045 ,  G06K2017/0087

    摘要： An ID recognizing system for a semiconductor manufacturing system includes IC modules set in surfaces of containers which accommodate wafers and are conveyed from one device to another in the semiconductor manufacturing system. Each IC module is capable of transmitting and receiving signals from fixed stations and includes a reloadable memory. The semiconductor manufacturing system is made up of a number of devices for performing manufacturing operations on the wafers in the containers, and each of the devices include one of the fixed stations. The IC module is powered by the energy of radio waves received from the fixed station in the device in which said container has been placed for processing of the wafers therein. The radio communication is in the form of communication packets which include data on individual wafers in the cassettes so that the individual wafers can be processed separately. The position or off-set of the data within the packet indicates the position of the corresponding wafer within the container.

    摘要翻译： 用于半导体制造系统的ID识别系统包括设置在容纳晶片的容器的表面中的IC模块，并且在半导体制造系统中从一个装置传送到另一个装置。 每个IC模块能够从固定站发送和接收信号，并且包括可重新加载的存储器。 半导体制造系统由用于对容器中的晶片进行制造操作的多个装置组成，并且每个装置包括固定站之一。 IC模块由在其中已经放置所述容器用于处理其中的晶片的装置中的固定站接收的无线电波的能量供电。 无线电通信是通信分组的形式，其包括在盒中的单个晶片上的数据，使得可以单独处理各个晶片。 分组内的数据的位置或偏移指示了相应晶片在容器内的位置。