公开(公告)号：US07947999B2

公开(公告)日：2011-05-24

申请号：US11616161

申请日：2006-12-26

申请人： Taizo Tomioka ,  Takahiro Suzuki ,  Hiroyuki Tokubo ,  Yukinori Aoki

发明人： Taizo Tomioka ,  Takahiro Suzuki ,  Hiroyuki Tokubo ,  Yukinori Aoki

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for sealing the light emitting diode chip and a part of the one main surface. The case seals the inner lead other than an area sealed by the transparent sealing material portion, and the inner lead of the die pad lead has bending portions at least two places including a first bending portion and a second bending portion. A rear of the first predetermined position in the inner lead of the die pad lead is exposed outside the case, and the second bending portion is formed in the case so that the outer lead extends from a side of the case.

摘要翻译： 一种发光装置，包括由内引线和外引线构成的管芯焊盘引线，用于连接内引线的壳体，安装在内引线的一个主表面的第一预定位置上的发光二极管芯片和透明密封 用于密封发光二极管芯片的材料部分和一个主表面的一部分。 壳体密封除了由透明密封材料部分密封的区域以外的内部引线，并且芯片焊盘引线的内部引线具有包括第一弯曲部分和第二弯曲部分的至少两个位置的弯曲部分。 芯片焊盘引线的内引线中的第一预定位置的后部暴露在壳体的外部，并且第二弯曲部分形成在壳体中，使得外引线从壳体的一侧延伸。

公开(公告)号：US20070145403A1

公开(公告)日：2007-06-28

申请号：US11616161

申请日：2006-12-26

申请人： Taizo TOMIOKA ,  Takahiro SUZUKI ,  Hiroyuki TOKUBO ,  Yukinori AOKI

发明人： Taizo TOMIOKA ,  Takahiro SUZUKI ,  Hiroyuki TOKUBO ,  Yukinori AOKI

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for sealing the light emitting diode chip and a part of the one main surface. The case seals the inner lead other than an area sealed by the transparent sealing material portion, and the inner lead of the die pad lead has bending portions at least two places including a first bending portion and a second bending portion. A rear of the first predetermined position in the inner lead of the die pad lead is exposed outside the case, and the second bending portion is formed in the case so that the outer lead extends from a side of the case.

摘要翻译： 一种发光装置，包括由内引线和外引线构成的管芯焊盘引线，用于连接内引线的壳体，安装在内引线的一个主表面的第一预定位置上的发光二极管芯片和透明密封 用于密封发光二极管芯片的材料部分和一个主表面的一部分。 壳体密封除了由透明密封材料部分密封的区域以外的内部引线，并且芯片焊盘引线的内部引线具有包括第一弯曲部分和第二弯曲部分的至少两个位置的弯曲部分。 芯片焊盘引线的内引线中的第一预定位置的后部暴露在壳体的外部，并且第二弯曲部分形成在壳体中，使得外引线从壳体的一侧延伸。