Solid-state imaging element
    1.
    发明授权
    Solid-state imaging element 有权
    固态成像元件

    公开(公告)号:US08723239B2

    公开(公告)日:2014-05-13

    申请号:US12172571

    申请日:2008-07-14

    IPC分类号: H01L31/062 H01L31/113

    CPC分类号: H01L27/14603 H01L27/14689

    摘要: A solid-state imaging element includes a photodiode formed in an upper portion of a semiconductor substrate to perform a photoelectric conversion, a silicon dioxide film formed on the substrate to cover the photodiode, and a silicon nitride film formed on the silicon dioxide film. The silicon nitride film has a thinner portion smaller in thickness than at least an end portion of the silicon nitride film entirely or partly over the photodiode.

    摘要翻译: 固态成像元件包括形成在半导体衬底的上部以进行光电转换的光电二极管,形成在衬底上以覆盖光电二极管的二氧化硅膜和形成在二氧化硅膜上的氮化硅膜。 氮化硅膜的厚度比氮化硅膜的至少一端部分薄,部分地比光电二极管的薄。

    Display apparatus and multi-display system
    2.
    发明申请
    Display apparatus and multi-display system 审中-公开
    显示设备和多显示系统

    公开(公告)号:US20060227073A1

    公开(公告)日:2006-10-12

    申请号:US11372352

    申请日:2006-03-10

    IPC分类号: G09G3/28

    摘要: A CCD 14 is disposed on the rear of the discharge cell structures 13, and light introduced from the discharge cell structures 13 to the rear side, or light leaked from the discharge cell structures 13 to the rear side is measured by the CCD 14. Then, the light amount measurement result outputted from the CCD 14 is quantified, and on the basis of this, the brightness correction is automatically performed.

    摘要翻译: CCD14设置在放电单元结构13的后面,并且通过CCD 14测量从放电单元结构13向后侧引入的光或从放电单元结构13向后侧泄漏的光。 然后,量化从CCD 14输出的光量测量结果,并且基于此,自动执行亮度校正。

    SOLID-STATE IMAGING ELEMENT AND METHOD FOR FABRICATING THE SAME
    3.
    发明申请
    SOLID-STATE IMAGING ELEMENT AND METHOD FOR FABRICATING THE SAME 有权
    固态成像元件及其制造方法

    公开(公告)号:US20090020795A1

    公开(公告)日:2009-01-22

    申请号:US12172571

    申请日:2008-07-14

    IPC分类号: H01L31/00 H01L21/00

    CPC分类号: H01L27/14603 H01L27/14689

    摘要: A solid-state imaging element includes a photodiode formed in an upper portion of a semiconductor substrate to perform a photoelectric conversion, a silicon dioxide film formed on the substrate to cover the photodiode, and a silicon nitride film formed on the silicon dioxide film. The silicon nitride film has a thinner portion smaller in thickness than at least an end portion of the silicon nitride film entirely or partly over the photodiode.

    摘要翻译: 固态成像元件包括形成在半导体衬底的上部以进行光电转换的光电二极管,形成在衬底上以覆盖光电二极管的二氧化硅膜和形成在二氧化硅膜上的氮化硅膜。 氮化硅膜的厚度比氮化硅膜的至少一端部分薄,部分地比光电二极管的薄。